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• AEC-Q100 Qualified for Automotive Applications
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• 1Mbps Isolated SPI Data Communications
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• Simple Galvanic Isolation Using Standard Transformers
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| • Bidirectional Interface Over a Single Twisted Pair
|
| • Supports Cable Lengths Up to 100 Meters |
| • Very Low EMI Susceptibility and Emissions |
| • Configurable for High Noise Immunity or Low Power |
| • Engineered for ISO26262 Compliant Systems |
| • Requires No Software Changes in Most SPI Systems |
| • Ultralow, 2µA Idle Current |
| • Automatic Wake-Up Detection |
| • Operating Temperature Range: –40°C to 125°C |
| • 2.7V to 5.5V Power Supply |
| • Interfaces to All Logic from 1.7V to 5.5V |
| • Available in 16-Lead QFN and MSOP Packages |
|
| CATALOG |
| LTC6820IMS#PBF COUNTRY OF ORIGIN |
LTC6820IMS#PBF PARAMETRIC INFO
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LTC6820IMS#PBF PACKAGE INFO
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LTC6820IMS#PBF MANUFACTURING INFO
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LTC6820IMS#PBF PACKAGING INFO
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LTC6820IMS#PBF EACD MODELS
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| LTC6820IMS#PBF APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Philippines |
| Malaysia |
| Thailand |
|
PARAMETRIC INFO
|
| Category |
Isolated Communications Interface |
| Transmission Media Type |
Cable |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Operating Supply Voltage (V) |
2.7 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Power Supply Type |
Analog |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Supply Current (mA) |
7 |
|
|
PACKAGE INFO
|
| Supplier packaging |
MSOP |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
16 |
| Pin shape |
Gull-wing |
| PCB |
16 |
| ears |
N/R |
| Pin spacing (mm) |
0.5 |
| Package length (mm) |
4.04 |
| Package width (mm) |
3 |
| Package height (mm) |
0.86 |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
4.04 |
| Package Overall Width (mm) |
4.9 |
| Package Overall Height (mm) |
1.1(Max) |
| Mounting surface height (mm) |
1.1(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Micro Small Outline Package |
| Package series name |
SO |
| JEDEC |
not applicable |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
260 |
| Wave soldering time (seconds) |
10 |
| Wave soldering temperature source |
Link to datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Plating materials |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
2 |
|
|
PACKAGING INFO
|
| Package |
Tube |
| Packing quantity |
37 |
| packaging type file |
Link to datasheet |
|
|
ECAD MODELS
|
 |
APPLICATIONS
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• Industrial Networking
|
| • Battery Monitoring Systems |
| • Remote Sensors |
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