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• RS232 Transceiver: 2500VRMS for 1 Minute |
• UL-CSA Recognized File #E151738 |
• CSA Component Acceptance Notice 5A |
• Isolated DC Power: 5V at Up to 200mA |
• No External Components Required |
• 1.62V to 5.5V Logic Supply for Flexible Digital
Interfacing |
• High Speed Operation
- 1Mbps for 250pF/3kΩ Load
2
- 50kbps for 1nF/3kΩ Load
- 100kbps for 2.5nF/3kΩ TIA/EIA-232-F Load |
• 3.3V (LTM2882-3) or 5V (LTM2882-5) Operation |
• No Damage or Latchup to ±10kV HBM ESD on
Isolated RS232 Interface or Across Isolation Barrier |
• High Common Mode Transient Immunity: 30kV/μs |
• Maximum Continuous Working Voltage: 560VPEAK |
• True RS232 Compliant Output Levels |
• 15mm × 11.25mm BGA and LGA Packages |
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CATALOG |
LTM2882HY-3#PBF COUNTRY OF ORIGIN |
LTM2882HY-3#PBF PARAMETRIC INFO |
LTM2882HY-3#PBF PACKAGE INFO |
LTM2882HY-3#PBF MANUFACTURING INFO |
LTM2882HY-3#PBF PACKAGING INFO |
LTM2882HY-3#PBF FUNCTIOAL BLOCK DIAGRAM |
LTM2882HY-3#PBF APPLICATIONS |
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COUNTRY OF ORIGIN |
Korea (Republic of) |
Malaysia |
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PARAMETRIC INFO |
Function |
Line Transceiver |
Number of Transceivers |
1 |
Number of Transmitters |
2 |
Number of Receivers |
2 |
Data Transmission Topology |
Point-to-Point |
Transmitter Signal Type |
Single-Ended |
Receiver Signal Type |
Single-Ended |
Transmitter Communication Type |
RS-232 |
Charge Pump |
Yes |
Receiver Communication Type |
RS-232 |
Power Down Mode |
Shutdown |
Channel Operating Mode |
Half Duplex |
Interface Standards |
RS-232 |
Number of Transmitter Enables |
0 |
Number of Receiver Enables |
0 |
Number of Drivers per Line |
1 |
Number of Receivers per Line |
1 |
Data Rate |
1Mbps(Min) |
Driving Mode |
No |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
105 |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-55 |
Power Supply Type |
Single |
Typical Single Supply Voltage (V) |
3.3 |
Minimum Single Supply Voltage (V) |
3 |
Maximum Single Supply Voltage (V) |
3.6 |
Maximum Supply Current (mA) |
30 |
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PACKAGE INFO |
Supplier Package |
BGA |
Basic Package Type |
Ball Grid Array |
Pin Count |
32 |
Lead Shape |
Ball |
PCB |
32 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
15 |
Package Width (mm) |
11.25 |
Package Height (mm) |
2.82 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
15 |
Package Overall Width (mm) |
11.25 |
Package Overall Height (mm) |
3.42 |
Seated Plane Height (mm) |
3.42 |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Ball Grid Array |
Package Family Name |
BGA |
Jedec |
N/A |
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MANUFACTURING INFO |
MSL |
3 |
Maximum Reflow Temperature (°C) |
245 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
260 |
Wave Solder Time (Sec) |
10 |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
SnAgCu |
Under Plating Material |
N/A |
Terminal Base Material |
N/A |
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PACKAGING INFO |
Packaging |
Tray |
Quantity Of Packaging |
119 |
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FUNCTIOAL BLOCK DIAGRAM |
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APPLICATIONS |
• Isolated RS232 Interface |
• Industrial Communication |
• Test and Measurement Equipment |
• Breaking RS232 Ground Loops |
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