LTM2882HY-3#PBF Analog Devices IC TXRX DUAL RS232 32-BGA

label:
2024/01/18 286


• RS232 Transceiver: 2500VRMS for 1 Minute
• UL-CSA Recognized File #E151738  
• CSA Component Acceptance Notice 5A
• Isolated DC Power: 5V at Up to 200mA
• No External Components Required
• 1.62V to 5.5V Logic Supply for Flexible Digital Interfacing
• High Speed Operation
   - 1Mbps for 250pF/3kΩ Load 2
   - 50kbps for 1nF/3kΩ Load
   - 100kbps for 2.5nF/3kΩ TIA/EIA-232-F Load
• 3.3V (LTM2882-3) or 5V (LTM2882-5) Operation
• No Damage or Latchup to ±10kV HBM ESD on Isolated RS232 Interface or Across Isolation Barrier  
• High Common Mode Transient Immunity: 30kV/μs
• Maximum Continuous Working Voltage: 560VPEAK
• True RS232 Compliant Output Levels
• 15mm × 11.25mm BGA and LGA Packages


CATALOG
LTM2882HY-3#PBF COUNTRY OF ORIGIN
LTM2882HY-3#PBF PARAMETRIC INFO
LTM2882HY-3#PBF PACKAGE INFO
LTM2882HY-3#PBF MANUFACTURING INFO
LTM2882HY-3#PBF PACKAGING INFO
LTM2882HY-3#PBF FUNCTIOAL BLOCK DIAGRAM  
LTM2882HY-3#PBF APPLICATIONS


COUNTRY OF ORIGIN
Korea (Republic of)
Malaysia


PARAMETRIC INFO
Function Line Transceiver
Number of Transceivers 1
Number of Transmitters 2
Number of Receivers 2
Data Transmission Topology Point-to-Point
Transmitter Signal Type Single-Ended
Receiver Signal Type Single-Ended
Transmitter Communication Type RS-232
Charge Pump Yes
Receiver Communication Type RS-232
Power Down Mode Shutdown
Channel Operating Mode Half Duplex
Interface Standards RS-232
Number of Transmitter Enables 0
Number of Receiver Enables 0
Number of Drivers per Line 1
Number of Receivers per Line 1
Data Rate 1Mbps(Min)
Driving Mode No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 105
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -55
Power Supply Type Single
Typical Single Supply Voltage (V) 3.3
Minimum Single Supply Voltage (V) 3
Maximum Single Supply Voltage (V) 3.6
Maximum Supply Current (mA) 30
 
PACKAGE INFO
Supplier Package BGA
Basic Package Type Ball Grid Array
Pin Count 32
Lead Shape Ball
PCB 32
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 15
Package Width (mm) 11.25
Package Height (mm) 2.82
Package Diameter (mm) N/R
Package Overall Length (mm) 15
Package Overall Width (mm) 11.25
Package Overall Height (mm) 3.42
Seated Plane Height (mm) 3.42
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Ball Grid Array
Package Family Name BGA
Jedec N/A
 
MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 245
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) SnAgCu
Under Plating Material N/A
Terminal Base Material N/A
 
PACKAGING INFO
Packaging Tray
Quantity Of Packaging 119
 
FUNCTIOAL BLOCK DIAGRAM



APPLICATIONS
• Isolated RS232 Interface
• Industrial Communication
• Test and Measurement Equipment
• Breaking RS232 Ground Loops

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