|
|
• Single Inductor Architecture Allows VIN Above,Below or Equal to VOUT
|
• Wide VIN Range: 4.5V to 36V
|
• Wide VOUT Range: 0.8V to 24V
|
• 5A DC (10A DC in Buck Mode)
|
• High Efficiency Up to 98%
|
• Current Mode Control
|
• Power Good Output Signal
|
• Phase-Lockable Fixed Frequency: 200kHz to 400kHz
|
• Ultrafast Transient Response
|
• Current Foldback Protection
|
• Output Overvoltage Protection
|
• Small, Low Profile Surface Mount LGA Package(15mm × 15mm × 2.8mm)
|
|
| CATALOG |
LTM4607EV#PBF COUNTRY OF ORIGIN
|
LTM4607EV#PBF PARAMETRIC INFO
|
LTM4607EV#PBF PACKAGE INFO
|
LTM4607EV#PBF MANUFACTURING INFO
|
LTM4607EV#PBF PACKAGING INFO
|
LTM4607EV#PBF ECAD MODELS
|
LTM4607EV#PBF APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Malaysia
|
Korea (Republic of)
|
|
PARAMETRIC INFO
|
| Isolation |
Non-Isolated |
| Type |
Step Down|Step Up |
| Number of Outputs |
1 |
| Output Voltage (V) |
0.8 to 24 |
| Maximum Output Current (A) |
10(Typ) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Extended |
| Switching Regulator |
Yes |
| Minimum Input Voltage (V) |
4.5 |
| Maximum Input Voltage (V) |
36 |
| Output Type |
Adjustable |
| Efficiency (%) |
98 |
| Load Regulation |
0.5% |
| Line Regulation |
0.02%/V |
| Switching Frequency (kHz) |
200 to 400 |
| Typical Standby Current (mA) |
1.6 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
125 |
| On/Off Logic |
Positive |
|
|
PACKAGE INFO
|
| Supplier Package |
LGA |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
141 |
| Lead Shape |
No Lead |
| PCB |
141 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
15 |
| Package Width (mm) |
15 |
| Package Height (mm) |
2.92(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
2.92(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
1.5 |
| Package Material |
Plastic |
| Package Description |
Land Grid Array Package |
| Package Family Name |
LGA |
| Jedec |
MO-222 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
4 |
| Maximum Reflow Temperature (°C) |
245 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Ni |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging |
Tray |
| Quantity Of Packaging |
119 |
|
|
| ECAD MODELS |
|
|
| APPLICATIONS |
• Telecom, Servers and Networking Equipment
|
• Industrial and Automotive Equipment
|
| • High Power Battery-Operated Devices |
| |
One-stop supplier of IC products