|
|
• Complete Solution in <1cm2
|
• Wide Input Voltage Range: 3.6V to 20V
|
• 3.3V Input Compatible with VIN Tied to INTVCC
|
| • 0.6V to 5.5V Output Voltage
|
| • Dual 2.5A (3A Peak) or Single 5A Output Current |
| • ±1.5% Maximum Total Output Voltage Regulation
Error Over Load, Line and Temperature |
| • Current Mode Control, Fast Transient Response
|
| • External Frequency Synchronization
|
| • Multiphase Parallelable with Current Sharing |
|
| CATALOG |
| LTM4622IV#PBF COUNTRY OF ORIGIN |
LTM4622IV#PBF PARAMETRIC INFO
|
LTM4622IV#PBF PACKAGE INFO
|
LTM4622IV#PBF MANUFACTURING INFO
|
LTM4622IV#PBF PACKAGING INFO
|
LTM4622IV#PBF ECAD MODELS
|
| LTM4622IV#PBF APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Malaysia |
| Korea (Republic of) |
|
PARAMETRIC INFO
|
| Isolation |
Non-Isolated |
| type |
Step Down |
| Number of Outputs |
2 |
| Output Voltage (V) |
0.6 to 5.5 |
| Regulation Condition Change In Load |
2.5A |
| Regulation Condition Change In Line |
16.4V |
| Maximum Output Current (A) |
2.5|2.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Rating |
Industrial |
| Switching Regulator |
yes |
| Minimum Input Voltage (V) |
3.6 |
| Maximum Input Voltage (V) |
20 |
| Output Type |
Adjustable |
| Load Regulation |
1% |
| Line Regulation |
0.1%/V |
| Switching Frequency (kHz) |
1000(Typ) |
| Typical Standby Current (mA) |
0.045 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
125 |
| On/Off Logic |
Positive |
|
|
PACKAGE INFO
|
| Supplier packaging |
LGA |
| Basic package type |
Non-Lead-Frame SMT |
| Number of pins |
25 |
| Pin shape |
No Lead |
| PCB |
25 |
| ears |
N/R |
| Pin spacing (mm) |
1.27 |
| Package length (mm) |
6.25 |
| Package width (mm) |
6.25 |
| Package height (mm) |
1.82 |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
6.25 |
| Package Overall Width (mm) |
6.25 |
| Package Overall Height (mm) |
1.82 |
| Mounting surface height (mm) |
1.82 |
| Install |
Surface Mount |
| Package weight (g) |
0.21 |
| Packaging materials |
Plastic |
| package instruction |
Land Grid Array Package |
| Package series name |
LGA |
| JEDEC |
MO-222 |
|
|
MANUFACTURING INFO
|
| MSL |
4 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Wave soldering temperature source |
Link to datasheet |
| Lead Finish(Plating) |
Au |
| Plating materials |
not applicable |
| Terminal Base Material |
not applicable |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Package |
Tray |
| Packing quantity |
260 |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• General Purpose Point-of-Load Conversion
|
• Telecom, Networking and Industrial Equipment
|
| • Medical Diagnostic Equipment |
• Test and Debug Systems
|
| |
| |
One-stop supplier of IC products