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• Complete Standalone Dual Power Supply
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• Single 16A or Dual 8A Output
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• Wide Input Voltage Range: 4.5V to 26.5V
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• Output Voltage Range: 0.6V to 5.5V
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• ±1.5% Total DC Output Error
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• Differential Remote Sense Amplifier
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• Current Mode Control/Fast Transient Response
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• Adjustable Switching Frequency
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• Overcurrent Foldback Protection
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• Multiphase Parallel Current Sharing with Multiple LTM4628s
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| CATALOG |
LTM4628IY#PBF COUNTRY OF ORIGIN
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LTM4628IY#PBF PARAMETRIC INFO
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LTM4628IY#PBF PACKAGE INFO
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LTM4628IY#PBF MANUFACTURING INFO
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LTM4628IY#PBF PACKAGING INFO
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LTM4628IY#PBF ECAD MODELS
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LTM4628IY#PBF APPLICATIONS
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COUNTRY OF ORIGIN
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Korea (Republic of)
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Malaysia
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PARAMETRIC INFO
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| Isolation |
Non-Isolated |
| Type |
Step Down |
| Number of Outputs |
2 |
| Output Voltage (V) |
0.6 to 5.5 |
| Maximum Output Current (A) |
8|8 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Industrial |
| Switching Regulator |
Yes |
| Minimum Input Voltage (V) |
4.5 |
| Maximum Input Voltage (V) |
26.5 |
| Output Type |
Adjustable |
| Load Regulation |
0.3% |
| Line Regulation |
0.04%/V |
| Switching Frequency (kHz) |
780(Typ) |
| Typical Standby Current (mA) |
0.06 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
125 |
| On/Off Logic |
Positive |
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PACKAGE INFO
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| Supplier Package |
BGA |
| Basic Package Type |
Ball Grid Array |
| Pin Count |
144 |
| Lead Shape |
Ball |
| PCB |
144 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
15 |
| Package Width (mm) |
15 |
| Package Height (mm) |
4.32 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
4.92 |
| Mounting |
Surface Mount |
| Package Weight (g) |
2.9 |
| Package Material |
Plastic |
| Package Description |
Plastic Ball Grid Array |
| Package Family Name |
BGA |
| Jedec |
MS-028 |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
245 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
SnAgCu |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tray |
| Quantity Of Packaging |
119 |
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| ECDA MODELS |
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| APPLICATIONS |
• Telecom and Networking Equipment
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• Storage and ATCA Cards
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• Industrial Equipment
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