|
|
• 0.6V to 5.5V Output Voltage
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• 4A DC, 5A Peak Output Current Each Channe
|
• Up to 5.5W Power Dissipation (TA = 60°C, 200 LFM, No Heat Sink)
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• ±1.5% Total Output Voltage Regulation
|
|
| CATALOG |
LTM4644EY#PBF COUNTRY OF ORIGIN
|
LTM4644EY#PBF PARAMETRIC INFO
|
LTM4644EY#PBF PACKAGE INFO
|
LTM4644EY#PBF MANUFACTURING INFO
|
LTM4644EY#PBF PACKAGING INFO
|
LTM4644EY#PBF ECAD MODELS
|
LTM4644EY#PBF APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Malaysia
|
|
PARAMETRIC INFO
|
| Isolation |
Non-Isolated |
| Type |
Step Down |
| Number of Outputs |
4 |
| Output Voltage (V) |
0.6 to 5.5 |
| Regulation Condition Change In Load |
4A |
| Regulation Condition Change In Line |
10V |
| Maximum Output Current (A) |
4|4|4|4 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Extended |
| Switching Regulator |
Yes |
| Minimum Input Voltage (V) |
4 |
| Maximum Input Voltage (V) |
14 |
| Output Type |
Adjustable |
| Load Regulation |
1% |
| Line Regulation |
0.15%/V |
| Switching Frequency (kHz) |
1000(Typ) |
| Typical Standby Current (mA) |
0.011 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| On/Off Logic |
Positive |
|
|
PACKAGE INFO
|
| Supplier Package |
BGA |
| Basic Package Type |
Ball Grid Array |
| Pin Count |
77 |
| Lead Shape |
Ball |
| PCB |
77 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
15 |
| Package Width (mm) |
9 |
| Package Height (mm) |
4.41 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
15 |
| Package Overall Width (mm) |
9 |
| Package Overall Height (mm) |
5.01 |
| Seated Plane Height (mm) |
5.01 |
| Mounting |
Surface Mount |
| Package Weight (g) |
1.9 |
| Package Material |
Plastic |
| Package Description |
Ball Grid Array |
| Package Family Name |
BGA |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
245 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
SnAgCu |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging |
Tray |
| Quantity Of Packaging |
170 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
 |
| |
| APPLICATIONS |
| • Multirail Point of Load Regulation |
| • FPGAs, DSPs and ASICs Applications |
| |
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