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• Quad Output Step-Down µModule® Regulator with 1.2A per Output Channel
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• Wide Input Voltage Range: 2.7V to 17V
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• 0.6V to 5.5V Output Voltage
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• 1.2A DC, Parallelable, Output Current Each Channel
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• ±1.5% Total Output Voltage Regulation
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• 100% Duty Cycle Operation
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| CATALOG |
LTM4668AIY#PBF COUNTRY OF ORIGIN
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LTM4668AIY#PBF PARAMETRIC INFO
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LTM4668AIY#PBF PACKAGE INFO
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LTM4668AIY#PBF MANUFACTURING INFO
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LTM4668AIY#PBF PACKAGING INFO
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LTM4668AIY#PBF ECAD MODELS
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LTM4668AIY#PBF APPLICATIONS
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COUNTRY OF ORIGIN
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Korea (Republic of)
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PARAMETRIC INFO
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| Isolation |
Non-Isolated |
| Type |
Step Down |
| Number of Outputs |
4 |
| Output Voltage (V) |
0.6 to 5.5 |
| Regulation Condition Change In Load |
1.2A |
| Regulation Condition Change In Line |
12V |
| Maximum Output Current (A) |
1.2|1.2|1.2|1.2 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Extended |
| Switching Regulator |
Yes |
| Minimum Input Voltage (V) |
2.7 |
| Maximum Input Voltage (V) |
17 |
| Output Type |
Adjustable |
| Load Regulation |
0.75% |
| Line Regulation |
0.1%/V |
| Maximum Switching Frequency (kHz) |
1500 to 3000 |
| Typical Standby Current (mA) |
0.001 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
125 |
| On/Off Logic |
Positive |
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PACKAGE INFO
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| Supplier Package |
BGA |
| Basic Package Type |
Ball Grid Array |
| Pin Count |
49 |
| Lead Shape |
Ball |
| PCB |
49 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.8 |
| Package Length (mm) |
6.25 |
| Package Width (mm) |
6.25 |
| Package Height (mm) |
1.7 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
2.1 |
| Mounting |
Surface Mount |
| Package Weight (g) |
0.79 |
| Package Material |
Plastic |
| Package Description |
Ball Grid Array |
| Package Family Name |
BGA |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
4 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tray |
| Quantity Of Packaging |
260 |
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ECAD MODELS
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| APPLICATIONS |
| • Telecom, Networking and Industrial Equipment |
| • Multi-Rail Point of Load Regulation |
| • FPGAs, DSPs and ASICs Application |
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