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• Dual, Fast, Analog Loops with Digital Interface for
Control and Monitoring
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• Wide Input Voltage Range: 4.5V to 26.5V
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• Output Voltage Range: 0.5V to 5.5V
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| • ±0.5% Maximum DC Output Error Over Temperature |
| • ±2.5% Current Readback Accuracy at 10A Load |
| • 400kHz PMBus-Compliant I2C Serial Interface |
| • Integrated 16-Bit ∆Σ ADC |
| • Supports Telemetry Polling Rates Up to 125Hz |
| • Constant Frequency Current Mode Control |
| • Parallel and Current Share Multiple Modules |
| • All 7-Bit Slave Addresses Supported |
|
| CATALOG |
| LTM4676AIY#PBF COUNTRY OF ORIGIN |
LTM4676AIY#PBF PARAMETRIC INFO
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LTM4676AIY#PBF PACKAGE INFO
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LTM4676AIY#PBF MANUFACTURING INFO
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LTM4676AIY#PBF PACKAGING INFO
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LTM4676AIY#PBF ECAD MODELS
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LTM4676AIY#PBF APPLICATIONS
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|
| COUNTRY OF ORIGIN |
| Korea (Republic of) |
| Malaysia |
|
PARAMETRIC INFO
|
| Isolation |
Non-Isolated |
| Type |
Step Down |
| Number of Outputs |
2 |
| Output Voltage (V) |
0.5 to 5.5 |
| Maximum Output Current (A) |
13|13 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Industrial |
| Switching Regulator |
Yes |
| Minimum Input Voltage (V) |
4.5 |
| Maximum Input Voltage (V) |
26.5 |
| Output Type |
Adjustable |
| Load Regulation |
0.5% |
| Line Regulation |
0.2%/V |
| Switching Frequency (kHz) |
537.5 |
| Typical Standby Current (mA) |
20 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
125 |
| On/Off Logic |
Positive |
|
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PACKAGE INFO
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| Supplier Package |
BGA |
| Basic Package Type |
Ball Grid Array |
| Pin Count |
144 |
| Lead Shape |
Ball |
| PCB |
144 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
16 |
| Package Width (mm) |
16 |
| Package Height (mm) |
4.41 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
16 |
| Package Overall Width (mm) |
16 |
| Package Overall Height (mm) |
5.01 |
| Seated Plane Height (mm) |
5.01 |
| Mounting |
Surface Mount |
| Package Weight (g) |
3.3 |
| Package Material |
Plastic |
| Package Description |
Plastic Ball Grid Array |
| Package Family Name |
BGA |
| Jedec |
N/A |
|
|
MANUFACTURING INFO
|
| MSL |
4 |
| Maximum Reflow Temperature (°C) |
245 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
SnAgCu |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging |
Tray |
| Quantity Of Packaging |
90 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• System Optimization, Characterization and Data Mining
in Prototype, Production and Field Environments
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