 |
|
• Compatible with following I2C bus modes:
– 1 MHz
– 400 kHz
– 100 kHz |
• Memory array:
– 512 Kbit (64 Kbyte) of EEPROM
– Page size: 128 byte
– Additional write lockable page (M24512-D order codes)
|
• Single supply voltage and high speed:
– 1 MHz clock from 1.7 V to 5.5 V |
• Write time:
– Byte write within 5 ms
– Page write within 5 ms |
• Operating temperature range:
– -40 °C up to +85 °C
|
| • Random and sequential read modes |
| • Write protect of the whole memory array |
| • Enhanced ESD/latch-Up protection |
| • More than 4 million write cycles |
| • More than 200-years data retention |
• Packages:
– SO8 ECOPACK2®
– TSSOP8 ECOPACK2®
– UFDFPN8 ECOPACK2®
– WLCSP ECOPACK2®
– Unsawn wafer (each die is tested)
|
|
| CATALOG |
| M24512-RMN6TP COUNTRY OF ORIGIN |
| M24512-RMN6TP PARAMETRIC INFO |
| M24512-RMN6TP PACKAGE INFO |
| M24512-RMN6TP MANUFACTURING INFO |
| M24512-RMN6TP PACKAGING INFO |
| M24512-RMN6TP ECAD MODELS |
|
| COUNTRY OF ORIGIN |
| Malaysia |
| China |
| Philippines |
| Thailand |
| Morocco |
|
| PARAMETRIC INFO |
| Density (bit) |
512K |
| Interface Type |
Serial-I2C |
| Maximum Operating Frequency (MHz) |
1 |
| Maximum Access Time (ns) |
500 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Programmability |
Yes |
| Density in Bits (bit) |
524288 |
| Maximum Operating Current (mA) |
5 |
| Hardware Data Protection |
Yes |
| Programming Voltage (V) |
1.8 to 5.5 |
| Organization |
64Kx8 |
| Data Retention (Year) |
200(Min) |
| Minimum Operating Supply Voltage (V) |
1.8 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Number of Bits per Word (bit) |
8 |
| Maximum Storage Temperature (°C) |
150 |
| Address Bus Width (bit) |
16 |
|
| |
| PACKAGE INFO |
| Supplier Package |
SO N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
4.9 |
| Package Width (mm) |
3.9 |
| Package Height (mm) |
1.25(Min) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4.9 |
| Package Overall Width (mm) |
6 |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
7.09(Max)|13(Max) |
| Reel Width (mm) |
12.4|13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
| |
| |
One-stop supplier of IC products