 |
|
| • SPI bus compatible serial interface |
| • 16Mb Flash memory
|
| • 75 MHz clock frequency (maximum)
|
| • Page program (up to 256 bytes) in 0.64ms (TYP) |
• Erase capability
• Sector erase: 512Kb in 0.6 s (TYP)
• Bulk erase: 16Mb in 13 s (TYP)
|
• Write protection
• Hardware write protection: protected area size
defined by non-volatile bits BP0, BP1, BP2
|
| • Deep power down: 1µA (TYP) |
• Electronic signature
• JEDEC standard 2-byte signature (2015h)
• Unique ID code (UID) and 16 bytes of read-only
data, available upon customer request
• RES command, one-byte signature (14h) for
backward compatibility |
| • More than 100,000 write cycles per sector |
| • More than 20 years data retention |
| • Automotive grade parts available |
• Packages (RoHS compliant)
• SO8N (MN) 150 mils
• SO8W (MW) 208 mils
• SO16 (MF) 300 mils
• VFDFPN8 (MP) MLP8 6mm x 5mm
• VFDFPN8 (ME) MLP8 8mm x 6mm
• UFDFPN8 (MC) MLP8 4mm x 3mm |
|
| CATALOG |
| M25P16-VMN6P COUNTRY OF ORIGIN |
| M25P16-VMN6P LIFECYCLE |
| M25P16-VMN6P PARAMETRIC INFO |
| M25P16-VMN6P PACKAGE INFO |
| M25P16-VMN6P MANUFACTURING INFO |
| M25P16-VMN6P PACKAGING INFO |
| M25P16-VMN6P ECAD MODELS |
|
| COUNTRY OF ORIGIN |
| China |
| Japan |
| Malaysia |
|
| LIFECYCLE |
Obsolete
Dec 05,2017 |
|
| PARAMETRIC INFO |
| Density (bit) |
16M |
| Cell Type |
NOR |
| Interface Type |
Serial-SPI |
| Block Organization |
Symmetrical |
| Boot Block |
No |
| Timing Type |
Synchronous |
| Architecture |
Sectored |
| Maximum Access Time (ns) |
15 |
| Programmability |
Yes |
| Typical Operating Supply Voltage (V) |
3|3.3 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Number of Bits per Word (bit) |
8 |
| Number of Words |
2M |
| Maximum Operating Current (mA) |
8 |
| Programming Voltage (V) |
2.7 to 3.6|8.5 to 9.5 |
| Maximum Operating Frequency (MHz) |
75 |
| Sector Size |
64Kbyte x 32 |
| Program Current (mA) |
15 |
| Address Bus Width (bit) |
24 |
| Minimum Operating Supply Voltage (V) |
2.7 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Maximum Erase Time (s) |
40/Chip |
| Maximum Programming Time (ms) |
5/Page |
| Command Compatible |
Yes |
| ECC Support |
No |
| Erase Suspend/Resume Modes Support |
No |
| Simultaneous Read/Write Support |
No |
| Support of Common Flash Interface |
No |
| Support of Page Mode |
No |
| Page Size |
256byte |
| Minimum Endurance (Cycles) |
100000 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Density in Bits (bit) |
16777216 |
| Process Technology |
110nm |
|
| PACKAGE INFO |
| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
4.9 |
| Package Width (mm) |
3.9 |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
| MANUFACTURING INFO |
| MSL |
N/A |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
| PACKAGING INFO |
| Packaging |
Tube |
| Quantity Of Packaging |
2000 |
| Packaging Document |
Link to Datasheet |
|
| ECAD MODELS |
 |
|
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