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• 5V ± 10% supply voltage in Read operation
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• Access time: 35ns
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• Low power consumption:– Active Current 30mA at 5MHz– Standby Current 100µA
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• Programming voltage: 12.75V ± 0.25V
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• Programming time: 100µs/Word
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• Electronic signature– Manufacturer Code: 20h– Device Code: 41h
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• Packages– ECOPACK® compliant versions
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| CATALOG |
M27C4001-10F1 COUNTRY OF ORIGIN
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M27C4001-10F1 PARAMETRIC INFO
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M27C4001-10F1 PACKAGE INFO
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M27C4001-10F1 MANUFACTURING INFO
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M27C4001-10F1 PACKAGING INFO
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M27C4001-10F1 ECAD MODELS
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COUNTRY OF ORIGIN
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Malaysia
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China
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India
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Korea (Republic of)
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Morocco
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Philippines
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Singapore
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PARAMETRIC INFO
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| Density (bit) |
4M |
| Interface Type |
Parallel |
| Maximum Access Time (ns) |
100 |
| Typical Operating Supply Voltage (V) |
5 |
| Reprogramming Technique |
UV |
| In-System Programmability |
In System|External |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
70 |
| Programmability |
Yes |
| Density in Bits (bit) |
4194304 |
| Maximum Operating Current (mA) |
50 |
| Programming Voltage (V) |
12.75 |
| Organization |
512Kx8 |
| Output Enable Access Time (ns) |
50 |
| Minimum Operating Supply Voltage (V) |
4.5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Operating Supply Voltage (V) |
5 |
| Process Technology |
CMOS |
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PACKAGE INFO
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| Supplier Package |
CFDIPW |
| Basic Package Type |
Through Hole |
| Pin Count |
32 |
| PCB |
32 |
| Tab |
N/R |
| Pin Pitch (mm) |
2.54 |
| Package Length (mm) |
42.04(Max) |
| Package Width (mm) |
13.36(Max) |
| Package Height (mm) |
4.5(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
5.72(Max) |
| Mounting |
Through Hole |
| Package Material |
Ceramic |
| Package Description |
Ceramic Frit Seal Dual In Line Package With Window |
| Package Family Name |
DIP |
| Jedec |
N/A |
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MANUFACTURING INFO
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| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Number of Reflow Cycle |
N/R |
| Standard |
IPC-1752 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Alloy 42 |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
2 |
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PACKAGING INFO
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| Packaging |
Tube |
| Quantity Of Packaging |
12 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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