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• Integrated, ultra low power SRAM, real-time
clock, power-fail control circuit and battery
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• BYTEWIDE™ RAM-like clock access
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• BCD coded year, month, day, date, hours,
minutes, and seconds
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• Frequency test output for real-time clock
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• Automatic power-fail chip deselect and WRITE
protection
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• WRITE protect voltages
VPFD = power-fail deselect voltage):
– M48T35: VCC = 4.75 to 5.5 V;
4.5 V ≤ VPFD ≤ 4.75 V
– M48T35Y: VCC = 4.5 to 5.5 V;
4.2 V ≤ VPFD ≤ 4.5 V
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• Self-contained battery and crystal in the
CAPHAT™ DIP package
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• SOIC package provides direct connection for a
SNAPHAT® housing containing the battery and
crystal
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• SNAPHAT® housing (battery and crystal) is
replaceable
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| CATALOG |
M48T35Y-70MH1F COUNTRY OF ORIGIN
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M48T35Y-70MH1F PARAMETRIC INFO
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M48T35Y-70MH1F PACKAGE INFO
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M48T35Y-70MH1F MANUFACTURING INFO
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M48T35Y-70MH1F PACKAGING INFO
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M48T35Y-70MH1F ECAD MODELS
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COUNTRY OF ORIGIN
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Malaysia
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PARAMETRIC INFO
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| Date Format |
DW:DM:M:Y |
| Time Format |
HH:MM:SS |
| User RAM (byte) |
256 |
| Bus Type |
Parallel |
| Function |
Clock/Calendar/NV Timekeeping RAM/Watchdog Timer/Battery Backup |
| Maximum Access Time (ns) |
70 |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
70 |
| Supplier Temperature Grade |
Commercial |
| Minimum Storage Temperature (°C) |
-40 |
| Maximum Storage Temperature (°C) |
85 |
| Minimum Operating Supply Voltage (V) |
4.5 |
| Typical Operating Supply Voltage (V) |
5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Power Dissipation (mW) |
1000 |
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PACKAGE INFO
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| Supplier Package |
SOH |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
28 |
| Lead Shape |
Gull-wing |
| PCB |
28 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
18.49(Max) |
| Package Width (mm) |
8.89(Max) |
| Package Height (mm) |
2.69(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
3.05(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
N/A |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
245 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
F |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
600 |
| Reel Diameter (in) |
13(Max) |
| Reel Width (mm) |
24.4 |
| Tape Pitch (mm) |
16 |
| Tape Width (mm) |
24 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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