 |
|
• High-speed:
- tPD = 11 ns (typ.) at VCC = 6 V |
• Low power dissipation:
- CC = 1 μA (max.) at TA = 25 °C |
• High noise immunity:
- VH(typ) = 0.9 V at VCC = 5 V
|
• Symmetrical output impedance:
- |IOH| = IOL = 4 mA (min.) |
• Balanced propagation delays:
- tPLH ≅ tPHL |
• Wide operating voltage range:
- VCC (opr) = 2 V to 6 V |
| • Pin and function compatible with 74 series 132 |
• ESD performance
– HBM: 2 kV
– MM: 200 V
– CDM: 1 kV |
|
| CATALOG |
| M74HC132YTTR COUNTRY OF ORIGIN |
| M74HC132YTTR PARAMETRIC INFO |
| M74HC132YTTR PACKAGE INFO |
| M74HC132YTTR MANUFACTURING INFO |
| M74HC132YTTR PACKAGING INFO |
| M74HC132YTTR ECAD MODELs |
|
| COUNTRY OF ORIGIN |
| Morocco |
|
| PARAMETRIC INFO |
| Logic Family |
HC |
| Logic Function |
NAND |
| Number of Element Inputs |
2-IN |
| Number of Element Outputs |
1 |
| Number of Elements per Chip |
4 |
| Number of Output Enables per Element |
0 |
| Number of Selection Inputs per Element |
0 |
| Process Technology |
CMOS |
| Input Type |
Schmitt Trigger |
| Minimum Operating Supply Voltage (V) |
2 |
| Maximum Operating Supply Voltage (V) |
6 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Maximum High Level Output Current (mA) |
-5.2 |
| Maximum Low Level Output Current (mA) |
5.2 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
105@2V|21@4.5V|18@6V |
| Absolute Propagation Delay Time (ns) |
160 |
| Propagation Delay Test Condition (pF) |
50 |
| Maximum Quiescent Current (uA) |
1 |
|
| PACKAGE INFO |
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
14 |
| Lead Shape |
Gull-wing |
| PCB |
14 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
5 |
| Package Width (mm) |
4.4 |
| Package Height (mm) |
1 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5 |
| Package Overall Width (mm) |
6.4 |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SOP |
| Jedec |
MO-153AB-1 |
| Package Outline |
Link to Datasheet |
|
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
|
| PACKAGING INFO |
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Packaging Document |
Link to Datasheet |
|
| ECAD MODELS |
 |
|
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