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• HIGH SPEED: tPD = 9 ns (TYP.) at VCC = 6V
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• LOW POWER DISSIPATION:ICC = 1µA(MAX.) at TA=25°C
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• HIGH NOISE IMMUNITY:VNIH = VNIL = 28 % VCC (MIN.)
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• SYMMETRICAL OUTPUT IMPEDANCE:|IOH| = IOL = 4mA (MIN)
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• BALANCED PROPAGATION DELAYS:tPLH ≅ tPHL
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• WIDE OPERATING VOLTAGE RANGE: VCC (OPR) = 2V to 6V
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• PIN AND FUNCTION COMPATIBLE WITH 74 SERIES 4075
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| CATALOG |
M74HC4075B1R COUNTRY OF ORIGIN
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M74HC4075B1R PARAMETRIC INFO
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M74HC4075B1R PACKAGE INFO
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M74HC4075B1R MANUFACTURING INFO
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M74HC4075B1R PACKAGING INFO
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M74HC4075B1R ECAD MODELS
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COUNTRY OF ORIGIN
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Morocco
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Korea (Republic of)
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China
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Singapore
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Malaysia
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Philippines
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India
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PARAMETRIC INFO
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| Logic Family |
HC |
| Logic Function |
OR |
| Number of Element Inputs |
3-IN |
| Number of Element Outputs |
1 |
| Number of Elements per Chip |
3 |
| Number of Output Enables per Element |
0 |
| Number of Selection Inputs per Element |
0 |
| Process Technology |
CMOS |
| Minimum Operating Supply Voltage (V) |
2 |
| Maximum Operating Supply Voltage (V) |
6 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Maximum High Level Output Current (mA) |
-5.2 |
| Maximum Low Level Output Current (mA) |
5.2 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
80@2V|16@4.5V|14@6V |
| Absolute Propagation Delay Time (ns) |
120 |
| Propagation Delay Test Condition (pF) |
50 |
| Maximum Quiescent Current (uA) |
1 |
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PACKAGE INFO
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| Supplier Package |
PDIP |
| Basic Package Type |
Through Hole |
| Pin Count |
14 |
| Lead Shape |
Through Hole |
| PCB |
14 |
| Tab |
N/R |
| Pin Pitch (mm) |
2.54 |
| Package Length (mm) |
20(Max) |
| Package Width (mm) |
7.1(Max) |
| Package Height (mm) |
5.1(Max) - 0.51(Min) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
5.1(Max) |
| Mounting |
Through Hole |
| Package Material |
Plastic |
| Package Description |
Plastic Dual In Line Package |
| Package Family Name |
DIP |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Number of Reflow Cycle |
N/R |
| Standard |
IPC-1752 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Shelf Life Condition |
N/A |
| Number of Wave Cycles |
2 |
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PACKAGING INFO
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| Packaging |
Tube |
| Quantity Of Packaging |
25 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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