|
|
| CATALOG |
M93C56-WMN6TP COUNTRY OF ORIGIN
|
M93C56-WMN6TP PARAMETRIC INFO
|
M93C56-WMN6TP PACKAGE INFO
|
M93C56-WMN6TP MANUFACTURING INFO
|
M93C56-WMN6TP PACKAGING INFO
|
M93C56-WMN6TP ECAD MODELS
|
|
COUNTRY OF ORIGIN
|
China
|
France
|
|
PARAMETRIC INFO
|
| Density (bit) |
2K |
| Interface Type |
Serial-Microwire |
| Maximum Operating Frequency (MHz) |
2 |
| Maximum Access Time (ns) |
200 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Programmability |
Yes |
| Density in Bits (bit) |
2048 |
| Maximum Supply Current (mA) |
2 |
| Hardware Data Protection |
Yes |
| Programming Voltage (V) |
2.5 to 5.5 |
| Organization |
256x8|128x16 |
| Data Retention (Year) |
200(Min) |
| Minimum Operating Supply Voltage (V) |
2.5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Number of Bits per Word (bit) |
8|16 |
| Address Bus Width (bit) |
9 |
|
|
PACKAGE INFO
|
| Supplier Package |
SO N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
4.9 |
| Package Width (mm) |
3.9 |
| Package Height (mm) |
1.38 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4.9 |
| Package Overall Width (mm) |
6 |
| Package Overall Height (mm) |
1.55 |
| Seated Plane Height (mm) |
1.55 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.42 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
1.65 |
| Minimum PACKAGE_DIMENSION_H |
1.1 |
| Maximum PACKAGE_DIMENSION_L |
5 |
| Minimum PACKAGE_DIMENSION_L |
4.8 |
| Maximum PACKAGE_DIMENSION_W |
4 |
| Minimum PACKAGE_DIMENSION_W |
3.8 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1.75 |
| Minimum Seated_Plane_Height |
1.35 |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
0.18 |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
0.84 |
| Terminal Thickness (mm) |
0.22 |
| Bottom Pad Length (mm) |
N/R |
| Bottom Pad Width (mm) |
N/R |
| Bottom Pad Chamfer |
N/R |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/A |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
7.09|13 |
| Reel Width (mm) |
12.4|13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
One-stop supplier of IC products