|
|
• Compatible with the Serial Peripheral Interface (SPI) bus
|
• Memory array– 16 Kb (2 Kbytes) of EEPROM– Page size: 32 bytes– Additional Write lockable Page (Identification page)
|
• Write– Byte Write within 5 ms– Page Write within 5 ms
|
• Write Protect: quarter, half or whole memory array
|
• High-speed clock: 20 MHz
|
• Operating temperature range: from -40°C up to +85°C
|
• Enhanced ESD protection
|
|
| CATALOG |
M95160-WMN6TP COUNTRY OF ORIGIN
|
M95160-WMN6TP PARAMETRIC INFO
|
M95160-WMN6TP PACKAGE INFO
|
M95160-WMN6TP MANUFACTURING INFO
|
M95160-WMN6TP PACKAGING INFO
|
M95160-WMN6TP ECAD MODELS
|
|
COUNTRY OF ORIGIN
|
China
|
|
PARAMETRIC INFO
|
| Supplier Package |
SO N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.65(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
|
|
ECAD MODELS
|
|
| |
One-stop supplier of IC products