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| CATALOG |
| M95M02-DRMN6TP COUNTRY OF ORIGIN |
M95M02-DRMN6TP PARAMETRIC INFO
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M95M02-DRMN6TP PACKAGE INFO
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M95M02-DRMN6TP MANUFACTURING INFO
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M95M02-DRMN6TP PACKAGING INFO
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M95M02-DRMN6TP EACD MODELS
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| COUNTRY OF ORIGIN |
| China |
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PARAMETRIC INFO
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| Density (bit) |
2M |
| Interface Type |
Serial-SPI |
| Maximum Operating Frequency (MHz) |
5 |
| Maximum Access Time (ns) |
80 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Programmability |
Yes |
| Density in Bits (bit) |
2097152 |
| Maximum Operating Current (mA) |
3 |
| Hardware Data Protection |
Yes |
| Programming Voltage (V) |
1.8 to 5.5 |
| Organization |
256Kx8 |
| Data Retention (Year) |
200(Min) |
| Minimum Operating Supply Voltage (V) |
1.8 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Number of Bits per Word (bit) |
8 |
| Address Bus Width (bit) |
24 |
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PACKAGE INFO
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| Supplier Package |
SO N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.65(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
7.09|13 |
| Reel Width (mm) |
12.4|13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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