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| CATALOG |
MA4AGSW1 PARAMETRIC INFO
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MA4AGSW1 PACKAGE INFO
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MA4AGSW1 MANUFACTURING INFO
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MA4AGSW1 PACKAGING INFO
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PARAMETRIC INFO
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| Switch Type |
SPST |
| Number of Switches |
1 |
| Switch Configuration |
Single SPST |
| Frequency Band (MHz) |
50 to 70000 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
125 |
| Process Technology |
GaAs |
| Maximum Insertion Loss (dB) |
0.6 |
| Maximum Frequency (MHz) |
70000 |
| Technology |
GaAs |
| Switching Speed (ns) |
10(Typ) |
| Minimum Isolation Voltage (dB) |
20 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
Chip |
| Basic Package Type |
N/A |
| Pin Count |
2 |
| Lead Shape |
N/A |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
0.78(Max) |
| Package Width (mm) |
0.65(Max) |
| Package Height (mm) |
0.11(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
N/A |
| Mounting |
N/R |
| Package Weight (g) |
N/A |
| Package Material |
N/A |
| Package Description |
An Unpackaged, Fully Tested Integrated Circuit Chip |
| Package Family Name |
N/A |
| Jedec |
N/A |
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MANUFACTURING INFO
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| MSL |
N/A |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
N/A |
| Number of Reflow Cycle |
N/A |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/A |
| Wave Solder Time (Sec) |
N/A |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
N/A |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/A |
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PACKAGING INFO
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| Packaging |
Waffle |
| Packaging Document |
Link to Datasheet |
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