
|
|
• Ultra Broad Bandwidth: 50 MHz to 50 GHz
|
• Insertion Loss: 0.7 dB
|
• Isolation: 31 dB @ 50 GHz
|
• Low Current Consumption:
-10 mA for Low Loss State
+10 mA for Isolation State
|
• MACOMs Unique AlGaAs Hetero-Junction Anode
Technology
|
• Silicon Nitride Passivation
|
• Internal Short-Circuit Current Limit
|
• Mirror Image Insertion Protection
|
• Polymer Scratch Protection
|
• RoHS* Compliant
|
|
| CATALOG |
MA4AGSW4 PARAMETRIC INFO
|
MA4AGSW4 PACKAGE INFO
|
MA4AGSW4 MANUFACTURING INFO
|
MA4AGSW4 PACKAGING INFO
|
MA4AGSW4 APPLICATIONS
|
|
PARAMETRIC INFO
|
| Type |
Switch |
| Configuration |
Octal |
| Maximum Reverse Voltage (V) |
25 |
| Frequency Range |
VHF|UHF|SHF|EHF |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
125 |
|
|
PACKAGE INFO
|
| Supplier Package |
Chip |
| Basic Package Type |
N/A |
| Pin Count |
5 |
| Lead Shape |
N/A |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
1.7 |
| Package Width (mm) |
1.52 |
| Package Height (mm) |
0.1 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.1 |
| Mounting |
N/R |
| Package Weight (g) |
N/A |
| Package Material |
N/A |
| Package Description |
An Unpackaged, Fully Tested Integrated Circuit Chip |
| Package Family Name |
N/A |
| Jedec |
N/A |
|
|
MANUFACTURING INFO
|
| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/A |
| Reflow Solder Time (Sec) |
N/A |
| Number of Reflow Cycle |
N/A |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/A |
| Wave Solder Time (Sec) |
N/A |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
N/A |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/A |
|
|
PACKAGING INFO
|
| Packaging |
Waffle |
| Packaging Document |
Link to Datasheet |
|
|
APPLICATIONS
|
• Aerospace & Defense
|
| • ISM |
|
| |