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• Item Summary
- 2.2uH±20%, 1.5A, 0806/2016 (EIA/JIS) |
• Lifecycle Stage
- Mass Production (Preferred) |
• Standard packaging quantity (minimum)
- Taping Embossed 3000pcs |
|
| CATALOG |
| MAKK2016T2R2M COUNTRY OF ORIGIN |
| MAKK2016T2R2M PARAMETRIC INFO |
| MAKK2016T2R2M PACKAGE INFO |
| MAKK2016T2R2M MANUFACTURING INFO |
| MAKK2016T2R2M PACKAGING INFO |
|
| COUNTRY OF ORIGIN |
| Philippines |
|
| PARAMETRIC INFO |
| Type |
Power Chip |
| Technology |
Wirewound |
| Core Material |
Metal |
| Inductance (H) |
2.2u |
| Tolerance |
20% |
| Inductance Test Frequency (Hz) |
2M |
| Maximum DC Current (A) |
1.5 |
| Maximum Saturation Current (A) |
1.5 |
| Maximum DC Resistance (Ohm) |
0.16 |
| Maximum Operating Temperature (°C) |
105 |
| Minimum Operating Temperature (°C) |
-40 |
| Operating Temperature (°C) |
-40 to 105 |
|
| PACKAGE INFO |
| Case Size |
0806 |
| Product Length (mm) |
2.1 |
| Product Depth (mm) |
1.7 |
| Product Height (mm) |
1 |
| Product Diameter (mm) |
N/R |
| Number of Terminals |
2 |
| Product Weight (g) |
N/A |
|
| MANUFACTURING INFO |
| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
5 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
N/A |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
|
| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
|
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