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• Meets or exceeds the requirements of TIA/EIA-232-F and ITU v.28 standards
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• ESD protection for RS-232 bus pins: ±15kV human-body model
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• Operates at 5V VCC supply
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• Operates up to 120kbit/s
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• Two drivers and two receivers
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• Latch-up performance exceeds 100mA Per JESD 78, class II
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| CATALOG |
MAX202IPWR COUNTRY OF ORIGIN
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MAX202IPWR PARAMETRIC INFO
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MAX202IPWR PACKAGE INFO
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MAX202IPWR MANUFACTURING INFO
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MAX202IPWR PACKAGING INFO
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MAX202IPWR ECAD MODELS
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MAX202IPWR APPLICATIONS
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COUNTRY OF ORIGIN
|
China
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Taiwan (Province of China)
|
Malaysia
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|
PARAMETRIC INFO
|
| Function |
Line Transceiver |
| Number of Transceivers |
2 |
| Number of Transmitters |
2 |
| Number of Receivers |
2 |
| Data Transmission Topology |
Point-to-Point |
| Transmitter Signal Type |
Single-Ended |
| Receiver Signal Type |
Single-Ended |
| Transmitter Communication Type |
RS-232 |
| Receiver Communication Type |
RS-232 |
| Charge Pump |
Yes |
| Number of External Capacitors |
4 |
| External Capacitor Capacitance (uF) |
0.1 |
| Channel Operating Mode |
Full Duplex |
| Fail Safe |
Open/Short |
| Input Logic Level |
TTL|CMOS |
| Interface Standards |
EIA/TIA-232-F|RS-232|V.28 |
| Number of Drivers per Line |
1 |
| Number of Receivers per Line |
1 |
| Data Rate |
120Kbps(Min) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Power Supply Type |
Single |
| Typical Single Supply Voltage (V) |
5 |
| Minimum Single Supply Voltage (V) |
4.5 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Maximum Supply Current (mA) |
15 |
|
|
PACKAGE INFO
|
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
5.1(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.1(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AB |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
 |
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| APPLICATIONS |
| • Battery-powered systems |
| • Notebooks |
| • Laptops |
| • Palmtop PCs |
| • Hand-held equipment |
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