|
|
• ±50V Isolated Data Interface
|
• +5V Single Supply
|
• Low-Cost Replacement for Opto-Isolated
Transceivers
|
• True Fail-Safe Receiver While Maintaining
EIA/TIA-485 Compliance
|
• Pin-Selectable Full/Half-Duplex Operation
|
• Phase Controls to Correct for Twisted-Pair
Reversal
|
• 25µA Low-Power Shutdown Mode
|
• Thermal Shutdown for Driver Overload Protection
|
• 28-Pin SSOP Package
|
• Slew Rate Limited Reduced EMI
|
|
| CATALOG |
| MAX3157CAI+T COUNTRY OF ORIGIN |
MAX3157CAI+T PARAMETRIC INFO
|
MAX3157CAI+T PACKAGE INFO
|
MAX3157CAI+T MANUFACTURING INFO
|
MAX3157CAI+T PACKAGING INFO
|
MAX3157CAI+T ECAD MODELS
|
MAX3157CAI+T APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Malaysia
|
Philippines
|
|
PARAMETRIC INFO
|
| Function |
Line Transceiver |
| Number of Transceivers |
1 |
| Number of Transmitters |
1 |
| Number of Receivers |
1 |
| Data Transmission Topology |
Multidrop|Multipoint |
| Transmitter Signal Type |
Differential |
| Receiver Signal Type |
Differential |
| Transmitter Communication Type |
RS-422|RS-485 |
| Receiver Communication Type |
RS-422|RS-485 |
| Interface Standards |
RS-422|RS-485 |
| Number of Transmitter Enables |
1 |
| Number of Receiver Enables |
1 |
| Number of Drivers per Line |
1@RS-422|32@RS-485 |
| Number of Receivers per Line |
10@RS-422|32@RS-485 |
| Data Rate |
250Kbps(Min) |
| Driving Mode |
3-State |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
70 |
| Supplier Temperature Grade |
Commercial |
| Power Supply Type |
Single |
| Typical Single Supply Voltage (V) |
5 |
| Minimum Single Supply Voltage (V) |
4.75 |
| Maximum Single Supply Voltage (V) |
5.25 |
| Maximum Supply Current (mA) |
85 |
|
|
PACKAGE INFO
|
| Supplier Package |
SSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
28 |
| Lead Shape |
Gull-wing |
| PCB |
28 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
10.33(Max) |
| Package Width (mm) |
5.38(Max) |
| Package Height (mm) |
1.78(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.99(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-150AH |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu C194 |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
12 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Industrial Controls
|
• Level Translators
|
• Telecommunications
|
• Local Area Networks
|
|
| |
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