MAX3221EEAE+T Analog Devices / Maxim Integrated IC TXRX RS232 250KBPS SD 16-SSOP

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2025/08/14 11
MAX3221EEAE+T Analog Devices / Maxim Integrated 	IC TXRX RS232 250KBPS SD 16-SSOP


CATALOG
MAX3221EEAE+T COUNTRY OF ORIGIN
MAX3221EEAE+T PARAMETRIC INFO
MAX3221EEAE+T PACKAGE INFO
MAX3221EEAE+T MANUFACTURING INFO
MAX3221EEAE+T PACKAGING INFO
MAX3221EEAE+T ECAD MODELS
MAX3221EEAE+T APPLICATIONS


COUNTRY OF ORIGIN
Taiwan (Province of China)


PARAMETRIC INFO
Function Line Transceiver
Number of Transceivers 1
Number of Transmitters 1
Number of Receivers 1
Data Transmission Topology Point-to-Point
Transmitter Signal Type Single-Ended
Receiver Signal Type Single-Ended
Transmitter Communication Type RS-232
Input Logic Level TTL|CMOS
Output Logic Level TTL|CMOS
Receiver Communication Type RS-232
Charge Pump Yes
Number of External Capacitors 4
External Capacitor Capacitance (uF) 0.1
Power Down Mode Shutdown
Typical Shutdown Current (uA) 1
Channel Operating Mode Full Duplex
Interface Standards EIA/TIA-232|RS-232|V.24|V.28
Number of Transmitter Enables 1
Number of Receiver Enables 1
Number of Drivers per Line 1
Number of Receivers per Line 1
Data Rate 250Kbps(Min)
Driving Mode 3-State
Process Technology BiCMOS
Maximum Absolute Supply Voltage (V) 6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Maximum Storage Temperature (°C) 160
Minimum Storage Temperature (°C) -65
Power Supply Type Single
Typical Single Supply Voltage (V) 3.3|5
Minimum Single Supply Voltage (V) 3
Maximum Single Supply Voltage (V) 5.5
Maximum Supply Current (mA) 1
Isolation No


PACKAGE INFO
Supplier Package SSOP
Basic Package Type Lead-Frame SMT
Pin Count 16
Lead Shape Gull-wing
PCB 16
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 6.33(Max)
Package Width (mm) 5.38(Max)
Package Height (mm) 1.78(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.99(Max)
Mounting Surface Mount
Terminal Width (mm) 0.38(Max)
Package Weight (g) N/A
Package Material Plastic
Package Description Shrink Small Outline Package
Package Family Name SO
Jedec MO-150AC
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/A
Wave Solder Time (Sec) N/A
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu 194
Number of Wave Cycles N/A


PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Quantity Of Packaging 2000
Reel Diameter (in) 13
Tape Pitch (mm) 12
Tape Width (mm) 16
Component Orientation Q1
Packaging Document Link to Datasheet


ECAD MODELS


 
APPLICATIONS
• Notebook, Subnotebook, and Palmtop Computers
• Cellular Phones  
• Battery-Powered Equipment
• Handheld Equipment
• Peripherals
• Printers
Продукт RFQ