|
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• ESD protection for RS-232 bus pins
– ±15 kV (HBM)
– ±8 kV (IEC61000-4-2, Contact discharge)
– ±15 kV (IEC61000-4-2, Air-gap discharge)
|
• Meets or exceeds the requirements of TIA/
EIA-232-F and ITU V.28 standards
|
• Operates with 3-V to 5.5-V VCC supply
|
• Operates up to 250 kbit/s
|
• Two drivers and two receivers
|
• Low supply current: 300 μA (typical)
|
• External capacitors: 4 × 0.1 μF
|
• Accepts 5-V logic input with 3.3-V supply
|
• Pin compatible to alternative high-speed devices
(1 Mbit/s)
– SN65C3232E (–40°C to +85°C)
– SN75C3232E (0°C to 70°C)
|
|
| CATALOG |
MAX3232EIDR COUNTRY OF ORIGIN
|
MAX3232EIDR PARAMETRIC INFO
|
MAX3232EIDR PACKAGE INFO
|
MAX3232EIDR MANUFACTURING INFO
|
MAX3232EIDR PACKAGING INFO
|
MAX3232EIDR ECAD MODELS
|
MAX3232EIDR APPLICATIONS
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|
COUNTRY OF ORIGIN
|
China
|
Malaysia
|
|
PARAMETRIC INFO
|
| Function |
Line Transceiver |
| Number of Transceivers |
2 |
| Number of Transmitters |
2 |
| Number of Receivers |
2 |
| Data Transmission Topology |
Point-to-Point |
| Transmitter Signal Type |
Single-Ended |
| Receiver Signal Type |
Single-Ended |
| Transmitter Communication Type |
RS-232 |
| Charge Pump |
Yes |
| Number of External Capacitors |
4 |
| Receiver Communication Type |
RS-232 |
| External Capacitor Capacitance (uF) |
0.1 |
| Channel Operating Mode |
Full Duplex |
| Interface Standards |
EIA/TIA-232-F|RS-232|V.28 |
| Number of Drivers per Line |
2 |
| Number of Receivers per Line |
2 |
| Data Rate |
250Kbps |
| Driving Mode |
3-State |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Power Supply Type |
Single |
| Typical Single Supply Voltage (V) |
3.3|5 |
| Minimum Single Supply Voltage (V) |
3 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Maximum Supply Current (mA) |
1 |
| Isolation |
No |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
10(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
10(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AC |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
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APPLICATIONS
|
• Industrial PCs
|
| • Wired networking |
• Data center and enterprise computing
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• Battery-powered systems
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| • Notebooks |
• Palmtop PCs
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• Hand-held equipment
|
| |
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