|
| |
• RS-232 Bus-terminal esd protection exceeds
±15 kV using human-body model (HBM)
|
• Meets or exceeds the requirements of TIA/
EIA-232-F and ITU V.28 standards
|
• Operates with 3-V to 5.5-V VCC supply
|
| • Operates up to 250 kbit/s |
| • Two drivers and two receivers |
| • Low supply current: 300 μA Typical |
| • External capacitors: 4 × 0.1 μF |
| • Accepts 5-V logic input with 3.3-V supply |
| • Alternative high-speed terminal-compatible devices (1 Mbit/s)– SN65C3232 (–40°C to 85°C)– SN75C3232 (0°C to 70°C) |
| |
| CATALOG |
| MAX3232IDR COUNTRY OF ORIGIN |
MAX3232IDR PARAMETRIC INFO
|
MAX3232IDR PACKAGE INFO
|
MAX3232IDR MANUFACTURING INFO
|
MAX3232IDR PACKAGING INFO
|
MAX3232IDR EACD MODELS
|
| MAX3232IDR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
| Mexico |
|
PARAMETRIC INFO
|
| Function |
Line Transceiver |
| Number of Transceivers |
2 |
| Number of Transmitters |
2 |
| Number of Receivers |
2 |
| Data Transmission Topology |
Point-to-Point |
| Transmitter Signal Type |
Single-Ended |
| Receiver Signal Type |
Single-Ended |
| Transmitter Communication Type |
RS-232 |
| Charge Pump |
Yes |
| Number of External Capacitors |
4 |
| External Capacitor Capacitance (uF) |
0.1 |
| Power Down Mode |
Shutdown |
| Typical Shutdown Current (uA) |
1 |
| Channel Operating Mode |
Full Duplex |
| Fail Safe |
Open/Short |
| Receiver Communication Type |
RS-232 |
| Input Logic Level |
TTL|CMOS |
| Output Logic Level |
TTL|CMOS |
| Interface Standards |
EIA/TIA-232-F|RS-232|V.28 |
| Number of Drivers per Line |
2 |
| Number of Receivers per Line |
2 |
| Data Rate |
250Kbps |
| Driving Mode |
3-State |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Power Supply Type |
Single |
| Typical Single Supply Voltage (V) |
3.3|5 |
| Minimum Single Supply Voltage (V) |
3 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Maximum Supply Current (mA) |
1 |
| Isolation |
No |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
10(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
10(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AC |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn|Au |
| Under Plating Material |
N/A|Pd over Ni |
| Terminal Base Material |
Cu Alloy|N/A |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
16.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
| APPLICATIONS |
| • Industrial PCs |
| • Wired networking |
| • Data center and enterprise networking |
| • Battery-powered systems |
| • PDAs |
| • Notebooks |
| • Laptops |
| • Palmtop PCs |
| • Hand-held equipment |
|
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