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• Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards
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• Operates With 3-V to 5.5-V VCC Supply
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• Operates Up To 250 kbit/s
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| • Two Drivers and Two Receivers
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| • Low Supply Current . . . 300 µA Typica |
| • External Capacitors . . . 4 × 0.1 µF |
| • Accepts 5-V Logic Input With 3.3-V Supply |
| • Alternative High-Speed Pin-Compatible Device(1 Mbit/s)– SNx5C3232 |
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| CATALOG |
| MAX3232MPWREP COUNTRY OF ORIGIN |
MAX3232MPWREP PARAMETRIC INFO
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MAX3232MPWREP PACKAGE INFO
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MAX3232MPWREP MANUFACTURING INFO
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MAX3232MPWREP PACKAGING INFO
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MAX3232MPWREP EACD MODELS
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| MAX3232MPWREP APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Taiwan (Province of China) |
| Malaysia |
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PARAMETRIC INFO
|
| Function |
Line Transceiver |
| Number of Transceivers |
2 |
| Number of Transmitters |
2 |
| Number of Receivers |
2 |
| Data Transmission Topology |
Point-to-Point |
| Transmitter Signal Type |
Single-Ended |
| Receiver Signal Type |
Single-Ended |
| Transmitter Communication Type |
RS-232 |
| Receiver Communication Type |
RS-232 |
| Interface Standards |
EIA/TIA-232-F|RS-232|V.28 |
| Number of Drivers per Line |
2 |
| Number of Receivers per Line |
2 |
| Data Rate |
250Kbps |
| Driving Mode |
3-State |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Rating |
Military |
| Power Supply Type |
Single |
| Typical Single Supply Voltage (V) |
3.3|5 |
| Minimum Single Supply Voltage (V) |
3 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Maximum Supply Current (mA) |
2 |
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PACKAGE INFO
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| Supplier packaging |
TSSOP |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
16 |
| Pin shape |
Gull-wing |
| PCB |
16 |
| ears |
N/R |
| Pin spacing (mm) |
0.65 |
| Package length (mm) |
5.1(Max) |
| Package width (mm) |
4.5(Max) |
| Package height (mm) |
1.05(Max) |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.1(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Mounting surface height (mm) |
1.2(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Thin Shrink Small Outline Package |
| Package series name |
SO |
| JEDEC |
MO-153AB |
| Package outline |
Link to datasheet |
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|
MANUFACTURING INFO
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| MSL |
1 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
Au |
| Plating materials |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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|
PACKAGING INFO
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| Packaging Suffix |
R |
| Package |
Tape and reel packaging |
| Packing quantity |
2000 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| packaging type file |
Link to datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • Battery-Powered Systems, PDAs, Notebooks,Laptops, Palmtop PCs, and Hand-Held Equipment |
| |
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