|
|
• Isolation Breaks Ground Loops Due to High CommonMode Voltages While Maintaining Data Rate
• ±50V Isolation
• 250kbps Guaranteed Data Rate
• FAULT Output Signals Excessive Isolated-Side
Voltage |
• Integration of Isolation and RS-232 Saves Space
• SSOP Package |
• Shutdown Allows Multiple Interfaces (IrDA, RS-232,
RS-485) to be Connected to the Same UART
• High-Impedance Transmitter and Receiver
Outputs in Shutdown
• 20µA Supply Current in Shutdown |
• Inductorless/Transformerless Design Simplifies EMI
Compliance |
• Low-Cost Replacement for Opto-Isolated
Transceivers |
• Meets EIA/TIA-232 Specifications Down to 3.0V |
|
CATALOG |
MAX3250CAI+ COUNTRY OF ORIGIN |
MAX3250CAI+ PARAMETRIC INFO |
MAX3250CAI+ PACKAGE INFO |
MAX3250CAI+ MANUFACTURING INFO |
MAX3250CAI+ PACKAGING INFO |
MAX3250CAI+ ECAD MODELS |
MAX3250CAI+ APPLICATIONS |
|
COUNTRY OF ORIGIN |
Philippines |
Malaysia |
|
PARAMETRIC INFO |
Function |
Line Transceiver |
Number of Transceivers |
1 |
Number of Transmitters |
2 |
Number of Receivers |
2 |
Data Transmission Topology |
Point-to-Point |
Transmitter Signal Type |
Single-Ended |
Receiver Signal Type |
Single-Ended |
Transmitter Communication Type |
RS-232 |
Charge Pump |
Yes |
Input Logic Level |
TTL|CMOS |
Output Logic Level |
TTL|CMOS |
Receiver Communication Type |
RS-232 |
Power Down Mode |
Shutdown |
Typical Shutdown Current (uA) |
20 |
Channel Operating Mode |
Full Duplex |
Interface Standards |
EIA/TIA-232-F|RS-232|V.24|V.28 |
Number of Transmitter Enables |
0 |
Number of Receiver Enables |
0 |
Number of Drivers per Line |
1 |
Number of Receivers per Line |
1 |
Data Rate |
250Kbps(Min) |
Driving Mode |
No |
Minimum Operating Temperature (°C) |
0 |
Maximum Operating Temperature (°C) |
70 |
Supplier Temperature Grade |
Commercial |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-65 |
Power Supply Type |
Single |
Typical Single Supply Voltage (V) |
3.3|5 |
Minimum Single Supply Voltage (V) |
3 |
Maximum Single Supply Voltage (V) |
5.5 |
Maximum Supply Current (mA) |
35 |
|
|
PACKAGE INFO |
Supplier Package |
SSOP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
28 |
Lead Shape |
Gull-wing |
PCB |
28 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
10.33(Max) |
Package Width (mm) |
5.38(Max) |
Package Height (mm) |
1.78(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
1.99(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Shrink Small Outline Package |
Package Family Name |
SO |
Jedec |
MO-150AH |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO |
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu C194 |
Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO |
Packaging |
Tube |
Quantity Of Packaging |
46 |
|
|
ECAD MODELS |
|
|
APPLICATIONS |
• Industrial Control |
• Programmable Logic Controller |
• Point-of-Sale Equipment |
• PC-to-Router Connections |
• Diagnostic Ports |
• Telecom Equipment |
|
|