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• ESD Protection for RS-485 I/O Pins• ±15kV—Human Body Model• ±8kV—IEC 1000-4-2, Contact Discharge• ±15kV—IEC 1000-4-2, Air-Gap Discharge
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• Operate from a Single +3.3V Supply—No Charge Pump Required
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• Interoperable with +5V Logic
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| • Guaranteed 12Mbps Data Rate(MAX3485E/MAX3490E/MAX3491E) |
| • Slew-Rate Limited for Errorless Data Transmission(MAX3483E/MAX3488E) |
| • 2nA Low-Current Shutdown Mode(MAX3483E/MAX3485E/MAX3486E/MAX3491E) |
| • -7V to +12V Common-Mode Input Voltage Range |
| • Full-Duplex and Half-Duplex Versions Available |
| • Industry-Standard 75176 Pinout(MAX3483E/MAX3485E/MAX3486E) |
| • Current-Limiting and Thermal Shutdown for Driver Overload Protection |
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| CATALOG |
| MAX3485EESA+T COUNTRY OF ORIGIN |
MAX3485EESA+T PARAMETRIC INFO
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MAX3485EESA+T PACKAGE INFO
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MAX3485EESA+T MANUFACTURING INFO
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MAX3485EESA+T PACKAGING INFO
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MAX3485EESA+T EACD MODELS
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| MAX3485EESA+T APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Philippines |
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PARAMETRIC INFO
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| Family Name |
STM8A |
| Data Bus Width (bit) |
8 |
| Device Core |
STM8A |
| Instruction Set Architecture |
CISC |
| Maximum Clock Rate (MHz) |
16 |
| Program Memory Type |
Flash |
| Program Memory Size |
8KB |
| RAM Size |
1KB |
| Maximum Expanded Memory Size |
16MB |
| Maximum CPU Frequency (MHz) |
16 |
| Number of Programmable I/Os |
16 |
| Number of Timers |
8 |
| ADC Channels |
5 |
| ADC Resolution (bit) |
10 |
| Core Architecture |
STM8 |
| Number of ADCs |
Single |
| PWM |
3 |
| Watchdog |
2 |
| Parallel Master Port |
No |
| Real Time Clock |
No |
| Interface Type |
I2C/SPI/UART |
| Programmability |
Yes |
| SPI |
1 |
| I2C |
1 |
| I2S |
0 |
| UART |
1 |
| USART |
0 |
| CAN |
0 |
| USB |
0 |
| Ethernet |
0 |
| Maximum Power Dissipation (mW) |
45 |
| Minimum Operating Supply Voltage (V) |
3 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Automotive |
| Operating Supply Voltage (V) |
3.3|5 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
20 |
| Lead Shape |
Gull-wing |
| PCB |
20 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
6.5 |
| Package Width (mm) |
4.4 |
| Package Height (mm) |
1 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
6.5 |
| Package Overall Width (mm) |
6.4 |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AC |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
10000 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • Telecommunications |
| • Industrial-Control Local Area Networks |
| • Transceivers for EMI-Sensitive Applications |
| • Integrated Services Digital Networks |
• Packet Switching
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