 |
|
| ♦ Low On-Resistance (2.5Ω max) |
| ♦ Guaranteed RON Match Between Channels
(0.5Ω max) |
| ♦ Guaranteed RON Flatness over Specified Signal
Range (0.5Ω max) |
| ♦ Rail-to-Rail Signal Handling |
| ♦ Guaranteed Break-Before-Make (MAX4663) |
| ♦ > 2kV ESD Protection per Method 3015.7 |
| ♦ +4.5V to +36V Single-Supply Operation
±4.5V to ±20V Dual-Supply Operation |
| ♦ TTL/CMOS-Compatible Control Inputs |
|
| CATALOG |
| MAX4661CAE+T COUNTRY OF ORIGIN |
| MAX4661CAE+T PARAMETRIC INFO |
| MAX4661CAE+T PACKAGE INFO |
| MAX4661CAE+T MANUFACTURING INFO |
| MAX4661CAE+T PACKAGING INFO |
| MAX4661CAE+T ECAD MODELS |
| MAX4661CAE+T APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Philippines |
|
| PARAMETRIC INFO |
| Type |
Analog Switch |
| Number of Channels per Chip |
4 |
| Switch Architecture |
SPST |
| Polarity |
Non-Inverting |
| Maximum On Resistance Range (Ohm) |
1 to 5 |
| Configuration |
Quad SPST |
| Number of Inputs per Chip |
4 |
| Function |
General |
| Number of Outputs per Chip |
4 |
| Chip Enable Signals |
Yes |
| Maximum On Resistance (Ohm) |
4@12V |
| Maximum Turn-On Time (ns) |
400@12V |
| Maximum Turn-Off Time (ns) |
250@12V |
| Maximum Power Dissipation (mW) |
571 |
| Input Signal Type |
Single |
| Output Signal Type |
Single |
| Maximum Low Level Output Current (mA) |
200 |
| Maximum High Level Output Current (mA) |
200 |
| Switch Control Logic |
Active Low |
| Switch Normal Position |
NC |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
70 |
| Supplier Temperature Grade |
Commercial |
| Power Supply Type |
Single|Dual |
| Minimum Single Supply Voltage (V) |
4.5 |
| Typical Single Supply Voltage (V) |
5|9|12|15|18|24|28 |
| Maximum Single Supply Voltage (V) |
36 |
| Minimum Dual Supply Voltage (V) |
±4.5 |
| Typical Dual Supply Voltage (V) |
±5|±9|±12|±15|±18 |
| Maximum Dual Supply Voltage (V) |
±20 |
| Typical Supply Current (mA) |
±0.000001@±15V |
| Maximum Supply Current (mA) |
±0.0005@±15V |
|
| PACKAGE INFO |
| Supplier Package |
SSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
6.33(Max) |
| Package Width (mm) |
5.38(Max) |
| Package Height (mm) |
1.78(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.99(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Shrink Small Outline Package |
| Package Family Name |
SOP |
| Jedec |
MO-150AC |
| Package Outline |
Link to Datasheet |
|
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu C194 |
| Number of Wave Cycles |
N/R |
|
| PACKAGING INFO |
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
12 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
| ECAD MODELS |
 |
|
| APPLICATIONS |
| ♦ Reed Relay Replacement |
| ♦ Test Equipment |
| ♦ Communication Systems |
| ♦ PBX, PABX Systems |
| ♦ Audio-Signal Routing |
| ♦ Avionics |
| ♦ ADC Systems |
| ♦ Sample-and-Hold Circuits |
| ♦ Data Acquisition Systems |
|
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