|
|
• USB 1.1 Signal Switching Compliant(TID = 4000231)
|
• 2ns (max) Differential Skew
|
• -3dB Bandwidth: > 300MHz
|
| • Low 15pF On-Channel Capacitance
|
| • Single-Supply Operation from +1.8V to +5.5V |
| • 4.5Ω RON (max) Switches (MAX4717/MAX4718)0.3Ω (max) RON Match (+3.0V Supply)1.2Ω (max) Flatness (+3.0V Supply) |
| • 20Ω RON (max) Switch (MAX4718)0.4Ω (max) RON Match (+3.0V Supply)1.2Ω (max) Flatness (+3.0V Supply) |
| • Rail-to-Rail Signal Handling |
| • High Off-Isolation: -55dB (10MHz) |
| • Low Crosstalk: -80dB (10MHz) |
| • Low Distortion: 0.03% |
| • +1.8V CMOS-Logic Compatible |
| • < 0.5nA Leakage Current at +25°C |
| |
| CATALOG |
| MAX4717EUB+T COUNTRY OF ORIGIN |
MAX4717EUB+T PARAMETRIC INFO
|
MAX4717EUB+T PACKAGE INFO
|
MAX4717EUB+T MANUFACTURING INFO
|
MAX4717EUB+T PACKAGING INFO
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MAX4717EUB+T EACD MODELS
|
| MAX4717EUB+T APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Philippines |
| |
PARAMETRIC INFO
|
| Type |
Analog Switch |
| Number of Channels per Chip |
2 |
| Switch Architecture |
SPDT |
| Polarity |
Non-Inverting |
| Maximum On Resistance Range (Ohm) |
10 to 25 |
| Configuration |
Dual SPDT |
| Number of Inputs per Chip |
2 |
| Function |
General |
| Number of Outputs per Chip |
4 |
| Chip Enable Signals |
Yes |
| Maximum On Resistance (Ohm) |
20@4.2V |
| Maximum Turn-On Time (ns) |
80@5.5V |
| Maximum Turn-Off Time (ns) |
40@5.5V |
| Maximum Power Dissipation (mW) |
444 |
| Input Signal Type |
Single |
| Output Signal Type |
Single |
| Maximum Low Level Output Current (mA) |
100 |
| Maximum High Level Output Current (mA) |
100 |
| Maximum Frequency (25°C) @ Vcc (MHz) |
300(Typ)@3V |
| Special Features |
Break-Before-Make |
| Switch Control Logic |
Active Low/High |
| Switch Normal Position |
NO/NC |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Extended |
| Power Supply Type |
Single |
| Minimum Single Supply Voltage (V) |
1.8 |
| Typical Single Supply Voltage (V) |
3|5 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Maximum Supply Current (mA) |
0.001@5.5V@-40C to 85C |
|
|
PACKAGE INFO
|
| Supplier Package |
uMAX |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
10 |
| Lead Shape |
Gull-wing |
| PCB |
10 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3.05(Max) |
| Package Width (mm) |
3.05(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.05(Max) |
| Package Overall Width (mm) |
5.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline Package |
| Package Family Name |
SOP |
| Jedec |
MO-187BA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu C7025 |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
|
|
ECAD MODELS
|
|
| |
| APPLICATIONS |
| • USB 1.1 Signal Switching Circuits |
| • Battery-Operated Equipment |
| • Audio/Video-Signal Routing |
| • Headphone Switching |
| • Low-Voltage Data-Acquisition Systems |
| • Sample-and-Hold Circuits |
| • Cell Phones |
| • PDAs |
| |
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