MAX5802BAUB+ Analog Devices / Maxim Integrated 12 Bit Digital to Analog Converter 2 10-uMAX

label:
2024/02/21 353



• Two High-Accuracy DAC Channels
 - 12-Bit Accuracy Without Adjustment
 - ±1 LSB INL Buffered Voltage Output
 - Monotonic Over All Operating Conditions
 - Independent Mode Settings for Each DAC
• Three Precision Selectable Internal References
 - 2.048V, 2.500V, or 4.096V
• Internal Output Buffer
 - Rail-to-Rail Operation with External Reference
 - 4.5µs Settling Time
 - Outputs Directly Drive 2kI Loads
• Small 5mm x 3mm 10-Pin µMAX or Ultra-Small3mm x 3mm 10-Pin TDFN Package
• Wide 2.7V to 5.5V Supply Range
• Separate 1.8V to 5.5V VDDIO Power-Supply Input
• Fast 400kHz I2C-Compatible, 2-Wire SerialInterface
• Power-On-Reset to Zero-Scale DAC Output
• CLR For Asynchronous Control
• Three Software-Selectable Power-Down OutputImpedances
 - 1kI, 100kI, or High Impedance
• Low 350µA Supply Current at 3V VDD


CATALOG
MAX5802BAUB+ COUNTRY OF ORIGIN
MAX5802BAUB+ PARAMETRIC INFO
MAX5802BAUB+ PACKAGE INFO
MAX5802BAUB+ MANUFACTURING INFO
MAX5802BAUB+ PACKAGING INFO
MAX5802BAUB+ ECAD MODELS
MAX5802BAUB+ FUNCTIONAL BLOCK DIAGRAM
MAX5802BAUB+ APPLICATIONS


COUNTRY OF ORIGIN
Thailand


PARAMETRIC INFO
Resolution 12bit
Number of DAC Channels 2
Number of Outputs per Chip 2
Converter Type General Purpose
Output Type Voltage
Voltage Reference Internal|External
Maximum Settling Time (us) 4.5(Typ)
Digital Interface Type Serial (2-Wire, I2C)
Output Polarity Unipolar
Integral Nonlinearity Error ±1LSB
Full Scale Error ±0.5%FSR
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Automotive
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single
Minimum Single Supply Voltage (V) 2.7
Typical Single Supply Voltage (V) 3.3|5
Maximum Single Supply Voltage (V) 5.5
Digital Supply Support No
Maximum Power Dissipation (mW) 707


PACKAGE INFO
Supplier Package uMAX
Basic Package Type Lead-Frame SMT
Pin Count 10
Lead Shape Gull-wing
PCB 10
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 3.05(Max)
Package Width (mm) 3.05(Max)
Package Height (mm) 0.95(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 3.05(Max)
Package Overall Width (mm) 5.05(Max)
Package Overall Height (mm) 1.1(Max)
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Micro Small Outline Package
Package Family Name SOP
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu 7025
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 50


ECAD MODELS



FUNCTIONAL BLOCK DIAGRAM



APPLICATIONS
• Programmable Voltage and Current Sources
• Gain and Offset Adjustment
• Automatic Tuning and Optical Control
• Power Amplifier Control and Biasing
• Process Control and Servo Loops
• Portable Instrumentation
• Data Acquisition


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