MAX6129BEUK33+T Analog Devices / Maxim Integrated IC VREF SERIES 3.3V SOT23-5

label:
2024/12/31 94
MAX6129BEUK33+T Analog Devices / Maxim Integrated IC VREF SERIES 3.3V SOT23-5


CATALOG
MAX6129BEUK33+T COUNTRY OF ORIGIN
MAX6129BEUK33+T PARAMETRIC INFO
MAX6129BEUK33+T PACKAGE INFO
MAX6129BEUK33+T MANUFACTURING INFO
MAX6129BEUK33+T PACKAGING INFO
MAX6129BEUK33+T ECAD MODELS


COUNTRY OF ORIGIN
Thailand
Taiwan (Province of China)
Malaysia
Indonesia
Philippines


PARAMETRIC INFO
Topology Series
Reference Type Precision
Output Voltage (V) 3.3
Initial Accuracy 1%
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Extended Industrial
Load Regulation 2.4uV/uA(Typ)
Line Regulation 30uV/V(Typ)
Maximum Input Voltage (V) 13
Maximum Output Current (mA) 4
Maximum Temperature Coefficient 100ppm/°C


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 5
Lead Shape Gull-wing
PCB 5
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 2.9
Package Width (mm) 1.63
Package Height (mm) 1.1
Package Diameter (mm) N/R
Package Overall Length (mm) 2.9
Package Overall Width (mm) 2.8
Package Overall Height (mm) 1.25
Seated Plane Height (mm) 1.25
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec MO-178AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu 194
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 7
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q2
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ