|
|
• Six (MAX6870) or Four (MAX6871) Configurable
Input Voltage Detectors
One High Voltage Input (+1.25V to +7.625V or
+2.5V to +13.2V Thresholds)
One Bipolar Voltage Input (±1.25V to ±7.625V
or ±2.5V to ±15.25V Thresholds)
Four (MAX6870) or Two (MAX6871) Positive
Voltage Inputs (+0.5V to +3.05V or +1V to
+5.5V Thresholds)
|
• Four General-Purpose Logic Inputs
|
• Two Configurable Watchdog Timers
|
• Eight (MAX6870) or Five (MAX6871)
Programmable Outputs
Active-High, Active-Low, Open-Drain, Weak
Pullup, Push-Pull, Charge-Pump
Timing Delays from 25µs to 1600ms
|
• 10-Bit Internal ADC Monitors the Input Voltage
Detectors and Two Auxiliary Inputs
|
| • Margining Disable and Manual Reset Controls |
| • Internal 1.25V Reference or External Reference
Input |
| • 4kb Internal User EEPROM
Endurance: 100,000 Erase/Write Cycles
Data Retention: 10 Years |
| • I2C/SMBus-Compatible Serial
Configuration/Communication Interface |
| • ±1% Threshold Accuracy |
|
| CATALOG |
MAX6870ETJ+ PARAMETRIC INFO
|
MAX6870ETJ+ PACKAGE INFO
|
MAX6870ETJ+ MANUFACTURING INFO
|
MAX6870ETJ+ PACKAGING INFO
|
MAX6870ETJ+ ECAD MODELS
|
MAX6870ETJ+ APPLICATIONS
|
|
PARAMETRIC INFO
|
| Output Driver |
Active High/Active Low/Open Drain |
| Manual Reset |
Yes |
| Watchdog Timer |
Yes |
| Number of Supervisors |
1 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Chip Enable Signals |
No |
| Power Fail Detection |
No |
| Battery Backup Switching |
No |
| Maximum Operating Supply Voltage (V) |
13.2 |
| Maximum Power Dissipation (mW) |
2667 |
| Maximum Supply Current (uA) |
1.3(Typ) |
| Minimum Operating Supply Voltage (V) |
4 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Type |
Voltage Supervisory |
| Programmability |
Yes |
|
|
PACKAGE INFO
|
| Supplier Package |
TQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
32 |
| Lead Shape |
No Lead |
| PCB |
32 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
7 |
| Package Width (mm) |
7 |
| Package Height (mm) |
0.73 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Thin Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
N/A |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
EFTEC 64T |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging |
Tube |
| Quantity Of Packaging |
43 |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Telecommunications/Central Office Systems
|
| • Networking Systems |
• Servers/Workstations
|
| • Basestations |
| • Storage Equipment |
| • Multimicroprocessor/Voltage Systems |
| |
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