MAX690AEPA+ Analog Devices / Maxim Integrated IC SUPERVISOR MPU 8-DIP

label:
2024/01/31 321


● Precision Supply Voltage Monitor:
    - 4.65V for MAX690A/MAX802L/MAX805L
    - 4.40V for MAX692A/MAX802M
● Reset Time Delay: 200ms
● Watchdog Timer: 1.6s Timeout
● Battery-Backup Power Switching
● 200μA Quiescent Supply Current
● 50nA Quiescent Supply Current in BatteryBackup Mode
● Voltage Monitor for Power-Fail or Low-Battery Warning
● Power-Fail Accuracy Guaranteed to ±2% (MAX802L/M)
● Guaranteed RESET Assertion to VCC = 1V
● 8-Pin SO and DIP Packages


CATALOG
MAX690AEPA+ COUNTRY OF ORIGIN
MAX690AEPA+ PARAMETRIC INFO
MAX690AEPA+ PACKAGE INFO
MAX690AEPA+ MANUFACTURING INFO
MAX690AEPA+ PACKAGING INFO
MAX690AEPA+ ECAD MODELS
MAX690AEPA+ BLOCK DIAGRAM
MAX690AEPA+ APPLICATIONS


COUNTRY OF ORIGIN
Philippines


PARAMETRIC INFO
Output Driver Active Low/Push-Pull
Manual Reset No
Watchdog Timer Yes
Number of Supervisors 1
Typical Reset Threshold Voltage (V) 4.65
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Chip Enable Signals No
Power Fail Detection Yes
Battery Backup Switching Yes
Maximum Reset Active Time (ms) 280
Maximum Operating Supply Voltage (V) 5.5
Minimum Reset Threshold Voltage (V) 4.5
Maximum Reset Threshold Voltage (V) 4.75
Monitored Voltage (V) 4.65
Maximum Power Dissipation (mW) 727
Maximum Supply Current (uA) 500
Minimum Operating Supply Voltage (V) 1.2
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 160
Type Voltage Supervisory
Programmability No
 
PACKAGE INFO
Supplier Package PDIP N
Basic Package Type Through Hole
Pin Count 8
Lead Shape Through Hole
PCB 8
Tab N/R
Pin Pitch (mm) 2.54
Package Length (mm) 9.91(Max)
Package Width (mm) 7.87(Max)
Package Height (mm) 4.45(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 4.57(Max)
Mounting Through Hole
Package Weight (g) N/A
Package Material Plastic
Package Description Plastic Dual In Line Package Narrow Body
Package Family Name DIP
Jedec MS-001AB
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/A
Wave Solder Time (Sec) N/A
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu C194
Number of Wave Cycles N/A
 
PACKAGING INFO
Packaging Tube
Quantity Of Packaging 50
 
ECAD MODELS


FUNCTIONAL BLOCK DIAGRAM


APPLICATIONS
● Battery-Powered Computers and Controllers
● Intelligent Instruments
● Critical μP Power Monitoring

Продукт RFQ