|
|
• Small µMAX Package
|
• 1mVp-p Output Voltage Ripple and Noise
|
• Power-OK Signal to Control GaAsFET Drain Switch
|
• 0.05µA Logic-Controlled Shutdown
|
• 1ms Guaranteed Startup
|
|
| CATALOG |
MAX881REUB+ PARAMETRIC INFO
|
MAX881REUB+ PACKAGE INFO
|
MAX881REUB+ MANUFACTURING INFO
|
MAX881REUB+ PACKAGING INFO
|
MAX881REUB+ ECAD MODELS
|
MAX881REUB+ APPLICATIONS
|
|
PARAMETRIC INFO
|
| Function |
Inverting |
| Minimum Operating Supply Voltage (V) |
2.5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Output Voltage (V) |
-0.5 to -4.9 |
| Output Type |
Adjustable |
| Output Current (mA) |
4(Max) |
| Switching Frequency (kHz) |
120 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Power Dissipation (mW) |
444 |
| Supplier Temperature Grade |
Extended |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
uMAX |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
10 |
| Lead Shape |
Gull-wing |
| PCB |
10 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3.05(Max) |
| Package Width (mm) |
3.05(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.05(Max) |
| Package Overall Width (mm) |
5.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline Package |
| Package Family Name |
SOP |
| Jedec |
MO-187BA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu C7025 |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging |
Tube |
| Quantity Of Packaging |
50 |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Cell Phones
|
• PCS Phones
|
• PHS Phones
|
| • Wireless Handsets |
| • Wireless Modems |
| • Two-Way Pagers |
| • Mobile Radios |
| • Wireless Computers |
| |
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