 |
|
| ● 10W Output (8Ω, PVDD = 14V, THD+N = 10%) |
| ● Spread-Spectrum Modulation |
| ● Meets EN55022B EMC with Ferrite Bead Filters |
| ● Amplifier Operation from 4.5V to 14V Supply |
| ● 64-Step Integrated Volume Control (I2C or Analog) |
| ● Low 0.08% THD+N (RL = 8Ω, POUT = 6W) |
● Two tON Times Offered
• MAX9768—220ms
• MAX9768B—15ms |
| ● Low-Power Shutdown Mode (0.5μA) |
| ● Short-Circuit and Thermal-Overload Protection |
|
| CATALOG |
| MAX9768BETG+T COUNTRY OF ORIGIN |
| MAX9768BETG+T PARAMETRIC INFO |
| MAX9768BETG+T PACKAGE INFO |
| MAX9768BETG+T MANUFACTURING INFO |
| MAX9768BETG+T PACKAGING INFO |
| MAX9768BETG+T ECAD MODELS |
| MAX9768BETG+T FUNCTIONAL BLOCK DIAGRAM |
| MAX9768BETG+T APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
| Malaysia |
| Thailand |
|
| PARAMETRIC INFO |
| Amplifier Type |
Class-D |
| Function |
Speaker |
| Input Signal Type |
Single |
| Output Signal Type |
Differential |
| Output Type |
1-Channel Mono |
| Power Supply Type |
Dual |
| Process Technology |
BiCMOS |
| Minimum Dual Supply Voltage (V) |
2.7|4.5 |
| Typical Dual Supply Voltage (V) |
3|5|9|12 |
| Maximum Dual Supply Voltage (V) |
3.6|14 |
| Maximum Load Resistance (Ohm) |
8 |
| Maximum Output Current (mA) |
2200 |
| Maximum Output Offset Voltage (mV) |
±14 |
| Typical Output Power (W) |
10 |
| Typical Output Power x Channels @ Load (W) |
10x1@8Ohm |
| Maximum Power Dissipation (mW) |
2220 |
| Typical Gain Bandwidth Product (MHz) |
1.8 |
| Typical PSRR (dB) |
77 |
| Typical Quiescent Current (mA) |
7@3.3V |
| Maximum Quiescent Current (mA) |
14.2@3.3V |
| Total Harmonic Distortion Noise |
0.08%@8Ohm@5W |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
| |
| PACKAGE INFO |
| Supplier Package |
TQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.73 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4 |
| Package Overall Width (mm) |
4 |
| Package Overall Height (mm) |
0.75 |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Description |
Thin Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
MO-220WGGD-2 |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu 194 |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
|
| |
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| ● Notebook Computers |
| ● Flat-Panel Displays |
| ● Multimedia Monitors |
| ● GPS Navigation Systems |
| ● Security/Personal Mobile Radio |
| |
| |
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