|
|
• 1.8V Single-Supply Operation
|
• Digital Highpass Elliptical Filters with Notch for
217Hz (GSM)
|
• Mono 30mW BTL Headphone Amplifier
|
• Dual Low-Noise Microphone Inputs
|
• Automatic Microphone Gain Control and Noise
Gate
|
• 90dB DAC DR (fS = 48kHz)
|
• 81dB ADC DR (fS = 48kHz)
|
• Supports Master Clock Frequencies from 10MHz
to 60MHz
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• Supports Sample Rates from 8kHz to 48kHz
|
• Flexible Digital Audio Interface
|
• Clickless/Popless Operation
|
• 2-Wire, I2C-Compatible Control Interface
|
• Available in 24-Pin, Thin QFN, 4mm x 4mm x
0.8mm Package
|
|
| CATALOG |
MAX9860ETG+T COUNTRY OF ORIGIN
|
MAX9860ETG+T PARAMETRIC INFO
|
MAX9860ETG+T PACKAGE INFO
|
MAX9860ETG+T MANUFACTURING INFO
|
MAX9860ETG+T PACKAGING INFO
|
MAX9860ETG+T ECAD MODELS
|
MAX9860ETG+T APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
|
PARAMETRIC INFO
|
| Type |
Voiceband |
| ADC/DAC Resolution (bit) |
16 |
| Number of ADCs |
1 |
| Number of DACs |
2 |
| Interface Type |
Serial (2-Wire, I2C, I2S) |
| Sampling Rate (ksps) |
48 |
| Number of Channels |
1ADC / 2DAC |
| Number of ADC Inputs |
2 |
| Number of DAC Outputs |
1 |
| Maximum Power Dissipation (mW) |
2222 |
| Total Harmonic Distortion Plus Noise (THD+N) (dB) |
-87 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Extended |
| Power Supply Type |
Analog|Digital |
| Typical Operating Supply Voltage (V) |
1.8 |
| Operating Supply Voltage (V) |
1.8 |
| Minimum Operating Supply Voltage (V) |
1.7 |
| Maximum Operating Supply Voltage (V) |
1.9|3.6 |
|
|
PACKAGE INFO
|
| Supplier Package |
TQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.73 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4 |
| Package Overall Width (mm) |
4 |
| Package Overall Height (mm) |
0.75 |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Description |
Thin Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
MO-220WGGD-2 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu 194 |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Audio Headsets
|
| • Portable Navigation Device |
• Mobile Phones
|
• Smart Phones
|
| • VoIP Phones |
| • Audio Accessories |
|
| |
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