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• Guardring for Stress Protection
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• Very Low Forward Voltage (0.38 V Max @ 0.5 A, 25C)
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• 125C Operating Junction Temperature
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| • Epoxy Meets UL 94 V−0 @ 0.125 in |
| • Package Designed for Optimal Automated Board Assembly |
| • AEC−Q101 Qualified and PPAP Capable |
| • SBR8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements |
| • All Packages are Pb−Free* |
| |
| CATALOG |
| MBR0520LT1G COUNTRY OF ORIGIN |
MBR0520LT1G PARAMETRIC INFO
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MBR0520LT1G PACKAGE INFO
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MBR0520LT1G MANUFACTURING INFO
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MBR0520LT1G PACKAGING INFO
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MBR0520LT1G EACD MODELS
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| COUNTRY OF ORIGIN |
| China |
|
PARAMETRIC INFO
|
| Type |
Schottky Diode |
| Configuration |
Single |
| Maximum DC Reverse Voltage (V) |
20 |
| Peak Reverse Repetitive Voltage (V) |
20 |
| Maximum Continuous Forward Current (A) |
0.5 |
| Average Rectified Forward Current (A) |
0.5 |
| Maximum Junction Ambient Thermal Resistance |
206°C/W |
| Peak Forward Voltage (V) |
0.385 |
| Peak Non-Repetitive Surge Current (A) |
5.5 |
| Peak Reverse Current (uA) |
250 |
| Operating Junction Temperature (°C) |
-65 to 125 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
125 |
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|
PACKAGE INFO
|
| Supplier Package |
SOD-123 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
Gull-wing |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
2.69 |
| Package Width (mm) |
1.6 |
| Package Height (mm) |
1.16 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.68 |
| Package Overall Width (mm) |
1.6 |
| Package Overall Height (mm) |
1.17 |
| Seated Plane Height (mm) |
1.17 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Diode Package |
| Package Family Name |
SOD |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
FeNi Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
T1 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4(Min) |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Anode Opposing Sprocket Hole |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
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ECAD MODELS
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