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• Guardring for Stress Protection
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• Low Forward Voltage
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• 125°C Operating Junction Temperature
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• Epoxy Meets UL 94 V−0 @ 0.125 in
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• Package Designed for Optimal Automated Board Assembly
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• ESD Rating:♦ Human Body Model = 3B♦ Machine Model = C
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• NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
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• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
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|
| CATALOG |
MBR140SFT1G COUNTRY OF ORIGIN
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MBR140SFT1G PARAMETRIC INFO
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MBR140SFT1G PACKAGE INFO
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MBR140SFT1G MANUFACTURING INFO
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MBR140SFT1G PACKAGING INFO
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MBR140SFT1G ECAD MODELS
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|
COUNTRY OF ORIGIN
|
Malaysia
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|
PARAMETRIC INFO
|
| Type |
Schottky Diode |
| Configuration |
Single |
| Material |
Si |
| Maximum DC Reverse Voltage (V) |
40 |
| Peak Reverse Repetitive Voltage (V) |
40 |
| Maximum Continuous Forward Current (A) |
1 |
| Average Rectified Forward Current (A) |
1 |
| Maximum Junction Ambient Thermal Resistance |
325°C/W |
| Peak Forward Voltage (V) |
0.85@3A |
| Peak Non-Repetitive Surge Current (A) |
30 |
| Peak Reverse Current (uA) |
500 |
| Operating Junction Temperature (°C) |
-55 to 125 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
125 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOD-123FL |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
Flat |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
2.7 |
| Package Width (mm) |
1.65 |
| Package Height (mm) |
0.9 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.6 |
| Package Overall Width (mm) |
1.65 |
| Package Overall Height (mm) |
0.95 |
| Seated Plane Height (mm) |
0.95 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Diode Package |
| Package Family Name |
SOD |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T1 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4(Min) |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1|Q2 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
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| ECAD MODELS |
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