MBRA340T3G onsemi DIODE SCHOTTKY 40V 3A SMA

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2024/09/29 146
MBRA340T3G onsemi DIODE SCHOTTKY 40V 3A SMA


• Small Compact Surface Mountable Package with J−Bent Leads
• Rectangular Package for Automated Handling
• Highly Stable Oxide Passivated Junction
• Very Low Forward Voltage Drop
• Guardring for Stress Protection
• NRVBA Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable*
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant


CATALOG
MBRA340T3G COUNTRY OF ORIGIN
MBRA340T3G PARAMETRIC INFO
MBRA340T3G PACKAGE INFO
MBRA340T3G MANUFACTURING INFO
MBRA340T3G PACKAGING INFO
MBRA340T3G ECAD MODELS


COUNTRY OF ORIGIN
China
Viet Nam
Malaysia


PARAMETRIC INFO
Type Schottky Diode
Configuration Single
Maximum DC Reverse Voltage (V) 40
Material Si
Peak Reverse Repetitive Voltage (V) 40
Maximum Continuous Forward Current (A) 3
Average Rectified Forward Current (A) 3
Maximum Junction Ambient Thermal Resistance 81°C/W
Peak Forward Voltage (V) 0.45
Peak Non-Repetitive Surge Current (A) 100
Peak Reverse Current (uA) 300
Operating Junction Temperature (°C) -55 to 150
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier Package SMA
Basic Package Type Lead-Frame SMT
Pin Count 2
Lead Shape J-Lead
PCB 2
Tab N/R
Pin Pitch (mm) N/R
Package Length (mm) 4.32
Package Width (mm) 2.6
Package Height (mm) 2
Package Diameter (mm) N/R
Package Overall Length (mm) 5.21
Package Overall Width (mm) 2.6
Package Overall Height (mm) 2.1
Seated Plane Height (mm) 2.1
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description SMD Plastic Package
Package Family Name DO
Jedec DO-214AC
Package Outline Link to Datasheet
Maximum PACKAGE_DIMENSION_H 2
Minimum PACKAGE_DIMENSION_H 1.92
Maximum PACKAGE_DIMENSION_L 4.57
Minimum PACKAGE_DIMENSION_L 4.06
Maximum PACKAGE_DIMENSION_W 2.92
Minimum PACKAGE_DIMENSION_W 2.29
Maximum Diameter N/R
Minimum Diameter N/R
Maximum Seated_Plane_Height 2.2
Minimum Seated_Plane_Height 1.97


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Shelf Life Period 24 Month
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix T3
Packaging Tape and Reel
Quantity Of Packaging 5000
Reel Diameter (in) 13
Reel Width (mm) 12.4(Min)
Tape Pitch (mm) 4
Tape Width (mm) 12
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Cathode At Sprocket Hole
Packaging Document Link to Datasheet
Tape Type Embossed


ECAD MODELS
Продукт RFQ