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• Small Compact Surface Mountable Package with J−Bent Leads
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• Rectangular Package for Automated Handling
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• Highly Stable Oxide Passivated Junction
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• Very Low Forward Voltage Drop
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• Guardring for Stress Protection
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• NRVBA Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable*
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• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
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CATALOG |
MBRA340T3G COUNTRY OF ORIGIN
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MBRA340T3G PARAMETRIC INFO
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MBRA340T3G PACKAGE INFO
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MBRA340T3G MANUFACTURING INFO
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MBRA340T3G PACKAGING INFO
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MBRA340T3G ECAD MODELS
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COUNTRY OF ORIGIN
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China
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Viet Nam
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Malaysia
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PARAMETRIC INFO
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Type |
Schottky Diode |
Configuration |
Single |
Maximum DC Reverse Voltage (V) |
40 |
Material |
Si |
Peak Reverse Repetitive Voltage (V) |
40 |
Maximum Continuous Forward Current (A) |
3 |
Average Rectified Forward Current (A) |
3 |
Maximum Junction Ambient Thermal Resistance |
81°C/W |
Peak Forward Voltage (V) |
0.45 |
Peak Non-Repetitive Surge Current (A) |
100 |
Peak Reverse Current (uA) |
300 |
Operating Junction Temperature (°C) |
-55 to 150 |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
150 |
Minimum Operating Temperature (°C) |
-55 |
Maximum Operating Temperature (°C) |
150 |
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PACKAGE INFO
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Supplier Package |
SMA |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
2 |
Lead Shape |
J-Lead |
PCB |
2 |
Tab |
N/R |
Pin Pitch (mm) |
N/R |
Package Length (mm) |
4.32 |
Package Width (mm) |
2.6 |
Package Height (mm) |
2 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5.21 |
Package Overall Width (mm) |
2.6 |
Package Overall Height (mm) |
2.1 |
Seated Plane Height (mm) |
2.1 |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
SMD Plastic Package |
Package Family Name |
DO |
Jedec |
DO-214AC |
Package Outline |
Link to Datasheet |
Maximum PACKAGE_DIMENSION_H |
2 |
Minimum PACKAGE_DIMENSION_H |
1.92 |
Maximum PACKAGE_DIMENSION_L |
4.57 |
Minimum PACKAGE_DIMENSION_L |
4.06 |
Maximum PACKAGE_DIMENSION_W |
2.92 |
Minimum PACKAGE_DIMENSION_W |
2.29 |
Maximum Diameter |
N/R |
Minimum Diameter |
N/R |
Maximum Seated_Plane_Height |
2.2 |
Minimum Seated_Plane_Height |
1.97 |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
N/A |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
Shelf Life Period |
24 Month |
Number of Wave Cycles |
N/R |
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PACKAGING INFO
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Packaging Suffix |
T3 |
Packaging |
Tape and Reel |
Quantity Of Packaging |
5000 |
Reel Diameter (in) |
13 |
Reel Width (mm) |
12.4(Min) |
Tape Pitch (mm) |
4 |
Tape Width (mm) |
12 |
Feed Hole Pitch (mm) |
4 |
Hole Center to Component Center (mm) |
2 |
Component Orientation |
Cathode At Sprocket Hole |
Packaging Document |
Link to Datasheet |
Tape Type |
Embossed |
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ECAD MODELS |
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