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• Compact Package with J−Bend Leads Ideal for Automated Handling
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• Highly Stable Oxide Passivated Junction
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• Guard−Ring for Over−Voltage Protection
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• Low Forward Voltage Drop
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• These are Pb−Free Devices
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| CATALOG |
MBRS260T3G COUNTRY OF ORIGIN
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MBRS260T3G PARAMETRIC INFO
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MBRS260T3G PACKAGE INFO
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MBRS260T3G MANUFACTURING INFO
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MBRS260T3G PACKAGING INFO
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COUNTRY OF ORIGIN
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Malaysia
|
Viet Nam
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China
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|
PARAMETRIC INFO
|
| Type |
Schottky Diode |
| Configuration |
Single |
| Maximum DC Reverse Voltage (V) |
60 |
| Material |
Si |
| Peak Reverse Repetitive Voltage (V) |
60 |
| Maximum Continuous Forward Current (A) |
2 |
| Average Rectified Forward Current (A) |
2 |
| Maximum Junction Ambient Thermal Resistance (°C/W) |
80 |
| Maximum Forward Voltage (V) |
0.63 |
| Peak Non-Repetitive Forward Surge Current (A) |
60 |
| Peak Reverse Current (uA) |
200 |
| Operating Junction Temperature (°C) |
-55 to 125 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
125 |
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PACKAGE INFO
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| Supplier Package |
SMB |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
J-Lead |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
4.32 |
| Package Width (mm) |
3.56 |
| Package Height (mm) |
2.2 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.44 |
| Package Overall Width (mm) |
3.56 |
| Package Overall Height (mm) |
2.3 |
| Seated Plane Height (mm) |
2.3 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
2.03 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
SMD Plastic Package |
| Package Family Name |
DO |
| Jedec |
DO-214AA |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_L |
4.6 |
| Minimum PACKAGE_DIMENSION_L |
4.06 |
| Maximum PACKAGE_DIMENSION_W |
3.95 |
| Minimum PACKAGE_DIMENSION_W |
3.3 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Minimum Seated_Plane_Height |
1.95 |
| Minimum PACKAGE_DIMENSION_H |
1.9 |
| Maximum PACKAGE_DIMENSION_H |
2.27 |
| Maximum Seated_Plane_Height |
2.47 |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
T3 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4(Min) |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Anode Opposing Sprocket Hole |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
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