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• Small Compact Surface Mountable Package with J-Bend Leads
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• Rectangular Package for Automated Handling
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• Highly Stable Oxide Passivated Junction
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| • Very Low Forward Voltage Drop(0.5 V Max @ 3.0 A, TJ = 25°C)
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| • Excellent Ability to Withstand Reverse Avalanche Energy Transients |
| • Guard-Ring for Stress Protection |
| • Device Passes ISO 7637 Pulse #1 |
| • SBRS8 and NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements;AEC−Q101 Qualified and PPAP Capable* |
| • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant |
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| CATALOG |
| MBRS340T3G COUNTRY OF ORIGIN |
MBRS340T3G PARAMETRIC INFO
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MBRS340T3G PACKAGE INFO
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MBRS340T3G MANUFACTURING INFO
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MBRS340T3G PACKAGING INFO
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MBRS340T3G EACD MODELS
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| COUNTRY OF ORIGIN |
| China |
| Malaysia |
| Viet Nam |
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PARAMETRIC INFO
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| type |
Schottky Diode |
| Configuration |
Single |
| Peak Reverse Repetitive Voltage (V) |
40 |
| Maximum DC Reverse Voltage (V) |
40 |
| Material |
Si |
| Maximum Continuous Forward Current (A) |
4 |
| Peak Forward Voltage (V) |
0.5@3A |
| Peak Non-Repetitive Surge Current (A) |
80 |
| Peak Reverse Current (uA) |
2000 |
| Operating Junction Temperature (°C) |
-65 to 150 |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier packaging |
SMC |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
2 |
| Pin shape |
J-Lead |
| PCB |
2 |
| ears |
N/R |
| Pin spacing (mm) |
N/R |
| Package length (mm) |
7.15(Max) |
| Package width (mm) |
6.25(Max) |
| Package height (mm) |
2.41(Max) |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
8.15(Max) |
| Package Overall Width (mm) |
6.25(Max) |
| Package Overall Height (mm) |
2.61(Max) |
| Mounting surface height (mm) |
2.61(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
SMD Plastic Package |
| Package series name |
DO-214-AB |
| JEDEC |
DO-214AB |
| Package outline |
Link to datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
not applicable |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Plating materials |
not applicable |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
T3 |
| Package |
Tape and reel packaging |
| Packing quantity |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
16.4(Min) |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Anode Opposing Sprocket Hole |
| packaging type file |
Link to datasheet |
| Tape Type |
Embossed |
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ECAD MODELS
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