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• Small Compact Surface Mountable Package with J−Bend Leads
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• Rectangular Package for Automated Handling
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• Highly Stable Oxide Passivated Junction
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• Excellent Ability to Withstand Reverse Avalanche Energy Transients
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• Guard−Ring for Stress Protection
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• NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable*
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• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
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| CATALOG |
MBRS540T3G COUNTRY OF ORIGIN
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MBRS540T3G PARAMETRIC INFO
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MBRS540T3G PACKAGE INFO
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MBRS540T3G MANUFACTURING INFO
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MBRS540T3G PACKAGING INFO
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MBRS540T3G ECAD MODELS
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COUNTRY OF ORIGIN
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China
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Malaysia
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Viet Nam
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PARAMETRIC INFO
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| Type |
Schottky Diode |
| Configuration |
Single |
| Maximum DC Reverse Voltage (V) |
40 |
| Material |
Si |
| Peak Reverse Repetitive Voltage (V) |
40 |
| Maximum Continuous Forward Current (A) |
5 |
| Process Technology |
Bipolar |
| Maximum Junction Ambient Thermal Resistance |
111°C/W |
| Peak Forward Voltage (V) |
0.5 |
| Peak Non-Repetitive Surge Current (A) |
190 |
| Peak Reverse Current (uA) |
300 |
| Operating Junction Temperature (°C) |
-65 to 150 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
SMC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
J-Lead |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
7.15(Max) |
| Package Width (mm) |
6.25(Max) |
| Package Height (mm) |
2.41(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
8.15(Max) |
| Package Overall Width (mm) |
6.25(Max) |
| Package Overall Height (mm) |
2.61(Max) |
| Seated Plane Height (mm) |
2.61(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
SMD Plastic Package |
| Package Family Name |
DO |
| Jedec |
DO-214AB |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
24 Month |
| Shelf Life Condition |
8°C to 30°C+30 % to 70 % RH |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
T3 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
16.4(Min) |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Anode Opposing Sprocket Hole |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
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| ECAD MODELS |
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