 |
|
| • Wide Input Voltage Range: 3 V to 40 V |
| • High Output Switch Current: Up to 1.5 A |
| • Adjustable Output Voltage |
| • Oscillator Frequency Up to 100 kHz |
| • Precision Internal Reference: 2% |
| • Short-Circuit Current Limiting |
| • Low Standby Current |
|
| CATALOG |
| MC33063ADR COUNTRY OF ORIGIN |
| MC33063ADR PARAMETRIC INFO |
| MC33063ADR PACKAGE INFO |
| MC33063ADR MANUFACTURING INFO |
| MC33063ADR PACKAGING INFO |
| MC33063ADR ECAD MODELS |
| MC33063ADR FUNCTIONAL BLOCK DIAGRAM |
| MC33063ADR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
| Mexico |
| Malaysia |
|
| PARAMETRIC INFO |
| Type |
Inverting|Step Up|Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
3 |
| Maximum Input Voltage (V) |
40 |
| Output Voltage (V) |
1.25 to 40 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Switching Frequency (kHz) |
42 |
| Switching Regulator |
Yes |
| Operating Supply Voltage (V) |
3 to 40 |
| Output Type |
Adjustable |
| Typical Quiescent Current (uA) |
4000 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Switch Current (A) |
1.5 |
|
| |
| PACKAGE INFO |
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.98(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| • Blood Gas Analyzers: Portable |
| • Cable Solutions |
| • HMIs (Human Machine Interfaces) |
| • Telecommunications |
| • Portable Devices |
| • Consumer & Computing |
| • Test & Measurement |
| |
One-stop supplier of IC products