|
|
• Low Input−to−Output Voltage Differential of 25 mV at IO = 10 mA,
and 260 mV at IO = 300 mA
|
• Extremely Tight Line and Load Regulation
|
• Stable with Output Capacitance of only 0.33 F for 2.5 V Output
Voltage
|
• Internal Current and Thermal Limiting
|
• NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
|
• These are Pb−Free Devices
|
|
| CATALOG |
| MC33275D-3.3R2G COUNTRY OF ORIGIN |
MC33275D-3.3R2G PARAMETRIC INFO
|
MC33275D-3.3R2G PACKAGE INFO
|
MC33275D-3.3R2G MANUFACTURING INFO
|
MC33275D-3.3R2G PACKAGING INFO
|
MC33275D-3.3R2G ECAD MODELS
|
MC33275D-3.3R2G APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
| China |
Philippines
|
Spain
|
|
PARAMETRIC INFO
|
| Type |
LDO |
| Number of Outputs |
1 |
| Maximum Output Current (A) |
0.3 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Output Type |
Fixed |
| Output Voltage Range (V) |
1.8 to 10 |
| Regulation Condition Change In Load |
250mA |
| Regulation Condition Change In Line |
7.7V |
| Junction to Ambient |
160°C/W |
| Junction to Case |
25°C/W |
| Polarity |
Positive |
| Special Features |
Current Limit|Short Circuit Protection|Thermal Shutdown Protection |
| Load Regulation |
25mV |
| Line Regulation |
10mV |
| Maximum Quiescent Current (mA) |
2 |
| Maximum Dropout Voltage @ Current (V) |
0.1@10mA|0.2@100mA|0.4@250mA|0.5@300mA |
| Minimum Input Voltage (V) |
2.6 |
| Maximum Input Voltage (V) |
13 |
| Output Voltage (V) |
3.3 |
| Typical Quiescent Current (mA) |
1.5 |
| Typical Dropout Voltage @ Current (V) |
0.025@10mA|0.115@100mA|0.22@250mA|0.26@300mA |
| Accuracy (%) |
±1 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical PSRR (dB) |
75 |
| Typical Output Noise Voltage (uVrms) |
160 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
265 |
| Wave Solder Time (Sec) |
5 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
CuFeZnPAg |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R2 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4(Min) |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Battery Powered Consumer Products
|
| • Hand−Held Instruments
|
• Camcorders and Cameras
|
|
|
| |
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