MC33926PNBR2 NXP Semiconductors IC MOTOR DRIVER PAR 32PQFN

label:
2023/09/25 391



• 5.0 V to 28 V continuous operation (transient operation from 5.0 V to 40 V)
• 225 mΩ maximum RDS(on) at 150 °C (each H-bridge MOSFET)
• 3.0 V and 5.0 V TTL/CMOS logic compatible inputs
• Overcurrent limiting (regulation) via an internal constant-off-time PWM
• Output short-circuit protection (short to VPWR or ground)
• Temperature dependent current limit threshold reduction
• All inputs have an internal source/sink to define the default (floating input) states
• Sleep mode with current draw < 50 µA (with inputs floating or set to match default logic states)
• AEC-Q100 grade 1 qualified


CATALOG
MC33926PNBR2 COUNTRY OF ORIGIN
MC33926PNBR2 PARAMETRIC INFO
MC33926PNBR2 PACKAGE INFO
MC33926PNBR2 MANUFACTURING INFO
MC33926PNBR2 PACKAGING INFO
MC33926PNBR2 ECAD MODELS
MC33926PNBR2 FUNCTIONAL BLOCK DIAGRAM
MC33926PNBR2 APPLICATIONS


COUNTRY OF ORIGIN
China
Faroe Islands
Poland


PARAMETRIC INFO
Type Motor Driver
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Minimum Operating Supply Voltage (V) 5
Operating Supply Voltage (V) 5 to 28
Maximum Operating Supply Voltage (V) 28
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Output Configuration Dual Half Bridge
Control Interface PWM
Maximum Output Current (A) 5
Maximum Peak Output Current (A) 5
Motor Type DC Motor


PACKAGE INFO
Supplier Package PQFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 32
Lead Shape No Lead
PCB 32
Tab N/R
Pin Pitch (mm) 0.8
Package Length (mm) 8
Package Width (mm) 8
Package Height (mm) 2.2(Max)
Package Diameter (mm) N/R
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Plastic Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 250
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 2000


ECAD MODELS



FUNCTIONAL BLOCK DIAGRAM



APPLICATIONS
• Electronic throttle control (ETC)
• Exhaust gas recirculation (EGR)
• Turbo flap control
• Industrial and medical pumps and motor control

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