MC34716EP NXP Semiconductors IC CONVERTER DDR 26QFN

label:
2025/09/17 5
MC34716EP NXP Semiconductors  IC CONVERTER DDR 26QFN

• 50 m integrated N-channel power MOSFETs
• Input voltage operating range from 3.0 to 6.0 V
• 1% accurate output voltages, ranging from 0.6 to 3.6 V
• The second output tracks 1/2 an external reference voltage
• Programmable switching frequency range from 200 kHz to 1.0 MHz


CATALOG
MC34716EP COUNTRY OF ORIGIN
MC34716EP LIFECYCLE
MC34716EP PARAMETRIC INFO
MC34716EP PACKAGE INFO
MC34716EP MANUFACTURING INFO
MC34716EP PACKAGING INFO
MC34716EP ECAD MODELS


COUNTRY OF ORIGIN
China
United States of America


LIFECYCLE
Obsolete
Dec 01,2021


PARAMETRIC INFO
Type Dual Switch Mode DDR
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Input Voltage (V) 3 to 6
Maximum Switching Frequency (kHz) 200 to 1000
Output Current (A) 5(Max)|3(Max)
Maximum Supply Current (mA) 35
Maximum Operating Supply Voltage (V) 6
Minimum Operating Supply Voltage (V) 3
Minimum Storage Temperature (°C) -65
Maximum Power Dissipation (mW) 2030
Maximum Storage Temperature (°C) 150


PACKAGE INFO
Supplier Package QFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 26
Lead Shape No Lead
PCB 26
Tab N/R
Package Length (mm) 5
Package Width (mm) 5
Package Height (mm) 1(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 40
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
 
PACKAGING INFO
Packaging Tray
Quantity Of Packaging 2450
Packaging Document Link to Datasheet
 
ECAD MODELS
Продукт RFQ