MC705J1ACDWE NXP Semiconductors IC MCU 8BIT 1.2KB OTP 20SOIC

label:
2025/06/5 6
MC705J1ACDWE NXP Semiconductors  IC MCU 8BIT 1.2KB OTP 20SOIC


CATALOG
MC705J1ACDWE LIFECYCLE
MC705J1ACDWE PARAMETRIC INFO
MC705J1ACDWE PACKAGE INFO
MC705J1ACDWE MANUFACTURING INFO
MC705J1ACDWE PACKAGING INFO


LIFECYCLE
Obsolete
Jan 15,2011


PARAMETRIC INFO
Family Name HC05
Data Bus Width (bit) 8
Device Core HC05
Instruction Set Architecture CISC
Maximum Clock Rate (MHz) 4
Program Memory Type EPROM
Program Memory Size 1240B
RAM Size 64B
Maximum CPU Frequency (MHz) 4
GPIO 14
Number of Timers 1
Watchdog 1
Interface Type SCI/SPI
Programmability Yes
SPI 1
I2C 0
I2S 0
UART 0
USART 0
CAN 0
USB 0
Ethernet 0
Minimum Operating Supply Voltage (V) 4.5
Typical Operating Supply Voltage (V) 5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Extended
Operating Supply Voltage (V) 5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package SOIC W
Basic Package Type Lead-Frame SMT
Pin Count 20
Lead Shape Gull-wing
PCB 20
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 12.95(Max)
Package Width (mm) 7.6(Max)
Package Height (mm) 2.4(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 2.65(Max)
Mounting Surface Mount
Package Weight (g) 0.5195
Package Material Plastic
Package Description Small Outline IC Wide Body
Package Family Name SO
Jedec MS-013AC
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 40
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Document Link to Datasheet


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