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CATALOG
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MCF5235CVM150 COUNTRY OF ORIGIN
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MCF5235CVM150 PARAMETRIC INFO
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MCF5235CVM150 PACKAGE INFO
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MCF5235CVM150 MANUFACTURING INFO
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MCF5235CVM150 PACKAGING INFO
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MCF5235CVM150 ECAD MODELS
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COUNTRY OF ORIGIN
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China
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Czechia
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Faroe Islands
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PARAMETRIC INFO
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| Family Name |
ColdFire MCF5xxx Processor |
| Data Bus Width (bit) |
32 |
| Device Core |
ColdFire |
| Maximum Speed (MHz) |
150 |
| Instruction Set Architecture |
RISC |
| Number of CPU Cores |
1 |
| Data Cache Size |
8KB |
| Instruction Cache Size |
8KB |
| On-Chip Memory |
64KB/SRAM |
| Ethernet Interface Type |
MII |
| Interface Type |
CAN/Ethernet/I2C/SPI/UART |
| Ethernet Speed |
10Mbps/100Mbps |
| Multiply Accumulate |
Yes |
| I2S |
0 |
| SPI |
1 |
| UART |
3 |
| USART |
0 |
| USB |
0 |
| Core Architecture |
ColdFire |
| CAN |
1 |
| Ethernet |
1 |
| I2C |
1 |
| Programmability |
No |
| Minimum Operating Supply Voltage (V) |
1.4|3 |
| Typical Operating Supply Voltage (V) |
1.5|3.3 |
| Maximum Operating Supply Voltage (V) |
1.6|3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Operating Supply Voltage (V) |
1.5|3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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| Supplier Package |
MAP-BGA |
| Basic Package Type |
Ball Grid Array |
| Pin Count |
256 |
| Lead Shape |
Ball |
| PCB |
256 |
| Tab |
N/R |
| Pin Pitch (mm) |
1 |
| Package Length (mm) |
17 |
| Package Width (mm) |
17 |
| Package Height (mm) |
1.16 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
17 |
| Package Overall Width (mm) |
17 |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
0.7748 |
| Package Material |
Plastic |
| Package Description |
Molded Array Process Ball Grid Array |
| Package Family Name |
BGA |
| Jedec |
MS-026BBC |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
40 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
SnAgCu |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tray |
| Quantity Of Packaging |
450 |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
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