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• 16-bit remote bidirectional I/O port
- 16 I/O pins default to 16 inputs |
| • Fast I2C™ bus clock frequency (0 - 400 kbits/s) |
| • Three hardware address pins allow use of up toeight devices |
| • High-current drive capability per I/O: ±25 mA |
| • Open-drain interrupt output on input change |
| • Interrupt port capture register |
| • Internal Power-On Reset (POR) |
| • Polarity inversion register to configure the polarity
of the input port data |
| • Compatible with most microcontrollers |
• Available temperature range:
- Industrial (I): -40°C to +85°C |
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| CATALOG |
| MCP23016-I/SS COUNTRY OF ORIGIN |
| MCP23016-I/SS PARAMETRIC INFO |
| MCP23016-I/SS PACKAGE INFO |
| MCP23016-I/SS MANUFACTURING INFO |
| MCP23016-I/SS PACKAGING INFO |
| MCP23016-I/SS ECAD MODELS |
| MCP23016-I/SS FUNCTIONAL BLOCK DIAGRAM
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| COUNTRY OF ORIGIN |
| Philippines |
| Thailand |
| China |
| Taiwan (Province of China) |
| Malaysia |
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| PARAMETRIC INFO |
| Number of I/Os |
16 |
| Interface Type |
I2C |
| I2C Bus Interface Mode |
Fast Mode |
| Interface Speed (kHz) |
400 |
| Number of Addresses |
8 |
| Output Type |
Quasi Bidirectional |
| Minimum Operating Supply Voltage (V) |
2 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Quiescent Current (uA) |
25(Typ) |
| Manual Reset |
Yes |
| Interrupt Output |
Yes |
| Supplier Temperature Grade |
Industrial |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Process Technology |
CMOS |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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| PACKAGE INFO |
| Supplier Package |
SSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
28 |
| Lead Shape |
Gull-wing |
| PCB |
28 |
| Tab |
N/R |
| Package Length (mm) |
10.2 |
| Package Width (mm) |
5.3 |
| Package Height (mm) |
1.75 |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Description |
Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-150AH |
| Package Outline |
Link to Datasheet |
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| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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| PACKAGING INFO |
| Packaging |
Tube |
| Quantity Of Packaging |
47 |
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| ECAD MODELS |
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| FUNCTIONAL BLOCK DIAGRAM |
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