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• 16-bit remote bidirectional I/O port
- 16 I/O pins default to 16 inputs |
• Fast I2C™ bus clock frequency (0 - 400 kbits/s) |
• Three hardware address pins allow use of up toeight devices |
• High-current drive capability per I/O: ±25 mA |
• Open-drain interrupt output on input change |
• Interrupt port capture register |
• Internal Power-On Reset (POR) |
• Polarity inversion register to configure the polarity
of the input port data |
• Compatible with most microcontrollers |
• Available temperature range:
- Industrial (I): -40°C to +85°C |
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CATALOG |
MCP23016-I/SS COUNTRY OF ORIGIN |
MCP23016-I/SS PARAMETRIC INFO |
MCP23016-I/SS PACKAGE INFO |
MCP23016-I/SS MANUFACTURING INFO |
MCP23016-I/SS PACKAGING INFO |
MCP23016-I/SS ECAD MODELS |
MCP23016-I/SS FUNCTIONAL BLOCK DIAGRAM
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COUNTRY OF ORIGIN |
Philippines |
Thailand |
China |
Taiwan (Province of China) |
Malaysia |
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PARAMETRIC INFO |
Number of I/Os |
16 |
Interface Type |
I2C |
I2C Bus Interface Mode |
Fast Mode |
Interface Speed (kHz) |
400 |
Number of Addresses |
8 |
Output Type |
Quasi Bidirectional |
Minimum Operating Supply Voltage (V) |
2 |
Maximum Operating Supply Voltage (V) |
5.5 |
Maximum Quiescent Current (uA) |
25(Typ) |
Manual Reset |
Yes |
Interrupt Output |
Yes |
Supplier Temperature Grade |
Industrial |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Process Technology |
CMOS |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO |
Supplier Package |
SSOP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
28 |
Lead Shape |
Gull-wing |
PCB |
28 |
Tab |
N/R |
Package Length (mm) |
10.2 |
Package Width (mm) |
5.3 |
Package Height (mm) |
1.75 |
Package Diameter (mm) |
N/R |
Mounting |
Surface Mount |
Package Description |
Shrink Small Outline Package |
Package Family Name |
SO |
Jedec |
MO-150AH |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
20 to 40 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020C |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO |
Packaging |
Tube |
Quantity Of Packaging |
47 |
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ECAD MODELS |
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FUNCTIONAL BLOCK DIAGRAM |
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