MCP23016-I/SS Microchip Technology IC I/O EXPANDER I2C 16B 28SSOP

label:
2024/02/2 359

 
• 16-bit remote bidirectional I/O port
   - 16 I/O pins default to 16 inputs
• Fast I2C™ bus clock frequency (0 - 400 kbits/s)
• Three hardware address pins allow use of up toeight devices
• High-current drive capability per I/O: ±25 mA
• Open-drain interrupt output on input change
• Interrupt port capture register
• Internal Power-On Reset (POR)
• Polarity inversion register to configure the polarity of the input port data
• Compatible with most microcontrollers
• Available temperature range:
   - Industrial (I): -40°C to +85°C


CATALOG
MCP23016-I/SS COUNTRY OF ORIGIN
MCP23016-I/SS PARAMETRIC INFO
MCP23016-I/SS PACKAGE INFO
MCP23016-I/SS MANUFACTURING INFO
MCP23016-I/SS PACKAGING INFO
MCP23016-I/SS ECAD MODELS
MCP23016-I/SS FUNCTIONAL BLOCK DIAGRAM  

 
COUNTRY OF ORIGIN
Philippines
Thailand
China
Taiwan (Province of China)
Malaysia


PARAMETRIC INFO
Number of I/Os 16
Interface Type I2C
I2C Bus Interface Mode Fast Mode
Interface Speed (kHz) 400
Number of Addresses 8
Output Type Quasi Bidirectional
Minimum Operating Supply Voltage (V) 2
Maximum Operating Supply Voltage (V) 5.5
Maximum Quiescent Current (uA) 25(Typ)
Manual Reset Yes
Interrupt Output Yes
Supplier Temperature Grade Industrial
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Process Technology CMOS
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
 
PACKAGE INFO
Supplier Package SSOP
Basic Package Type Lead-Frame SMT
Pin Count 28
Lead Shape Gull-wing
PCB 28
Tab N/R
Package Length (mm) 10.2
Package Width (mm) 5.3
Package Height (mm) 1.75
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Shrink Small Outline Package
Package Family Name SO
Jedec MO-150AH
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
 
PACKAGING INFO
Packaging Tube
Quantity Of Packaging 47
 
ECAD MODELS
  

FUNCTIONAL BLOCK DIAGRAM

Продукт RFQ